Masafumi Miyagawa

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Kitakyushu, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of dicing a semiconductor wafer
- Patent number 4,610,079
- Issue date Sep 9, 1986
- Tokyo Shibaura Denki Kabushiki Kaisha
- Masahiro Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device monolithically comprising a V-MOSFET and bipol...
- Patent number 4,589,004
- Issue date May 13, 1986
- Tokyo Shibaura Denki Kabushiki Kaisha
- Seiji Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion of aluminum
- Patent number 4,451,303
- Issue date May 29, 1984
- Tokyo Shibaura Denki Kabushiki Kaisha
- Shunichi Hiraki
- H01 - BASIC ELECTRIC ELEMENTS