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Masafumi Seino

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  • Ishikawa, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Lead-free solder paste and its use
    • Patent number 8,227,536
    • Issue date Jul 24, 2012
    • Senju Metal Industry Co., Ltd.
    • Shizuharu Watanabe
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    Lead-Free Solder Paste and Its Use
    • Publication number 20100035072
    • Publication date Feb 11, 2010
    • Shizuharu Watanabe
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR