Masaharu Shirai

Person

Kusatsu, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit board and mounting structure
- Patent number 8,446,734
- Issue date May 21, 2013
- Kyocera Corporation
- Katsura Hayashi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin film, adhesive sheet, circuit board, and electronic apparatus
- Patent number 8,129,623
- Issue date Mar 6, 2012
- Kyocera Corporation
- Tadashi Nagasawa
- B32 - LAYERED PRODUCTS
Information Patent Grant
Fiber-reinforced resin and method for manufacturing the same
- Patent number 8,012,561
- Issue date Sep 6, 2011
- Kyocera Corporation
- Masaaki Harazono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a built-up circuit board
- Patent number 6,612,028
- Issue date Sep 2, 2003
- International Business Machines Corporation
- Masaharu Shirai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lithography method and method for producing a wiring board
- Patent number 6,338,937
- Issue date Jan 15, 2002
- International Business Machines Corporation
- Masaharu Shirai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Circuit board and fabrication method thereof
- Patent number 6,048,465
- Issue date Apr 11, 2000
- International Business Machines Corporation
- Masaharu Shirai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stepped configured circuit board
- Patent number 5,998,739
- Issue date Dec 7, 1999
- International Business Machines Corporation
- Masaharu Shirai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing process for organic chip carrier
- Patent number 5,784,781
- Issue date Jul 28, 1998
- International Business Machines Corporation
- Masaharu Shirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a chip carrier with migration barrier, and r...
- Patent number 5,776,662
- Issue date Jul 7, 1998
- International Business Machines Corporation
- Masaharu Shirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a resin laying in a surface laminated circuit
- Patent number 5,766,825
- Issue date Jun 16, 1998
- International Business Machines Corp.
- Masaharu Shirai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of making printed circuit board
- Patent number 5,537,740
- Issue date Jul 23, 1996
- International Business Machines Corporation
- Masaharu Shirai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making substrate member having electrical lines and apert...
- Patent number 5,517,756
- Issue date May 21, 1996
- International Business Machines Corporation
- Masaharu Shirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board with landless blind hole for connecting an up...
- Patent number 5,510,580
- Issue date Apr 23, 1996
- International Business Machines Corporation
- Masaharu Shirai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming a smooth-surfaced insulating layer
- Patent number 5,460,858
- Issue date Oct 24, 1995
- International Business Machines Corporation
- Shinji Yamada
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Substrate member having electric lines and apertured insulating film
- Patent number 5,252,781
- Issue date Oct 12, 1993
- International Business Machines Corporation
- Masaharu Shirai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Circuit Board and Mounting Structure
- Publication number 20100259910
- Publication date Oct 14, 2010
- KYOCERA CORPORATION
- Katsura Hayashi
- B32 - LAYERED PRODUCTS
Information Patent Application
Fiber-Reinforced Resin and Method for Manufacturing the Same
- Publication number 20100136284
- Publication date Jun 3, 2010
- KYOCERA CORPORATION
- Masaaki Harazono
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Resin Film, Adhesive Sheet, Circuit Board, and Electronic Apparatus
- Publication number 20090314526
- Publication date Dec 24, 2009
- KYOCERA CORPORATION
- Tadashi Nagasawa
- B32 - LAYERED PRODUCTS

Masaharu Shirai

Person

Patents Grantslast 30 patents

Circuit board and mounting structure

Resin film, adhesive sheet, circuit board, and electronic apparatus

Fiber-reinforced resin and method for manufacturing the same

Method for manufacturing a built-up circuit board

Lithography method and method for producing a wiring board

Circuit board and fabrication method thereof

Stepped configured circuit board

Manufacturing process for organic chip carrier

Method for fabricating a chip carrier with migration barrier, and r...

Method of forming a resin laying in a surface laminated circuit

Method of making printed circuit board

Method of making substrate member having electrical lines and apert...

Printed circuit board with landless blind hole for connecting an up...

Method for forming a smooth-surfaced insulating layer

Substrate member having electric lines and apertured insulating film

Patents Applicationslast 30 patents

Circuit Board and Mounting Structure

Fiber-Reinforced Resin and Method for Manufacturing the Same

Resin Film, Adhesive Sheet, Circuit Board, and Electronic Apparatus