Masaharu TAKIZAWA

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Patents Grantslast 30 patents

Information Patent Grant
Bonding apparatus and bonding method
- Patent number 11,855,036
- Issue date Dec 26, 2023
- Kioxia Corporation
- Masaharu Takizawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20230290669
- Publication date Sep 14, 2023
- KIOXIA Corporation
- Makoto Kubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20210272924
- Publication date Sep 2, 2021
- KIOXIA Corporation
- Masaharu TAKIZAWA
- H01 - BASIC ELECTRIC ELEMENTS