Masaharu Yamamoto

Person

Suita, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing hermetic sealing lid member
- Patent number 11,178,786
- Issue date Nov 16, 2021
- Hitachi Metals, Ltd.
- Masayuki Yokota
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hermetic sealing lid member
- Patent number 10,595,424
- Issue date Mar 17, 2020
- Hitachi Metals, Ltd.
- Masayuki Yokota
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing hermetic sealing lid member, and method fo...
- Patent number 10,461,001
- Issue date Oct 29, 2019
- Hitachi Metals, Ltd.
- Masayuki Yokota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Battery terminal, method for manufacturing battery terminal, and ba...
- Patent number 10,193,126
- Issue date Jan 29, 2019
- Hitachi Metals, Ltd.
- Yoshimitsu Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Battery terminal, method for manufacturing battery terminal, and ba...
- Patent number 9,525,228
- Issue date Dec 20, 2016
- Hitachi Metals, Ltd.
- Yoshimitsu Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection plate for battery terminals and method for manufacturing...
- Patent number 9,350,007
- Issue date May 24, 2016
- Neomax Materials Co., Ltd.
- Yoshimitsu Oda
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Connection plate for battery terminals and method for manufacturing...
- Patent number 8,785,029
- Issue date Jul 22, 2014
- Neomax Materials Co., Ltd.
- Yoshimitsu Oda
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Airtightly sealing cap, electronic component storing package and me...
- Patent number 8,551,623
- Issue date Oct 8, 2013
- Neomax Materials Co., Ltd.
- Masaharu Yamamoto
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Hermetic sealing cap
- Patent number 8,431,820
- Issue date Apr 30, 2013
- Neomax Materials Co., Ltd.
- Masaharu Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic sealing cap, electronic component accommodation package, a...
- Patent number 7,790,988
- Issue date Sep 7, 2010
- Neomax Materials Co., Ltd.
- Tsuyoshi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic sealing cap and method of manufacturing the same
- Patent number 7,173,331
- Issue date Feb 6, 2007
- Neomax Materials Co., Ltd.
- Shigeji Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump transfer sheet, method for producing the same, and meth...
- Patent number 6,943,102
- Issue date Sep 13, 2005
- Neomax Co., Ltd.
- Masaharu Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder bump transfer sheet, method for producing the same, and meth...
- Patent number 6,677,229
- Issue date Jan 13, 2004
- Sumitomo Special Metals Co., Ltd.
- Masaharu Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing metal ball and semiconductor package
- Patent number 6,290,746
- Issue date Sep 18, 2001
- Sumitomo Special Metals Co., Ltd.
- Masaharu Yamamoto
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Polymer, surface modifier for inorganic materials and modified prod...
- Patent number 5,288,826
- Issue date Feb 22, 1994
- Nippon Paint Co., Ltd.
- Masaharu Yamamoto
- B82 - NANO-TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING HERMETIC SEALING LID MEMBER
- Publication number 20190289738
- Publication date Sep 19, 2019
- Hitachi Metals, Ltd.
- Masayuki Yokota
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HERMETIC SEALING LID MEMBER AND ELECTRONIC COMPONENT HOUSING PACKAGE
- Publication number 20170367205
- Publication date Dec 21, 2017
- Hitachi Metals, Ltd.
- Masayuki Yokota
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HERMETIC SEALING LID MEMBER, METHOD FOR MANUFACTURING HERMETIC SEAL...
- Publication number 20170354049
- Publication date Dec 7, 2017
- Hitachi Metals, Ltd.
- Masayuki Yokota
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING HERMETIC SEALING LID MEMBER, HERMETIC SEAL...
- Publication number 20170330811
- Publication date Nov 16, 2017
- Hitachi Metals, Ltd.
- Masayuki Yokota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS BONDING MATERIAL AND MULTILAYER GLASS
- Publication number 20170283318
- Publication date Oct 5, 2017
- Hitachi Metals, Ltd.
- Masayuki Yokota
- B32 - LAYERED PRODUCTS
Information Patent Application
BATTERY TERMINAL, METHOD FOR MANUFACTURING BATTERY TERMINAL, AND BA...
- Publication number 20160118641
- Publication date Apr 28, 2016
- NEOMAX MATERIALS CO., LTD
- Yoshimitsu Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COVER MATERIAL FOR HERMETIC SEALING AND PACKAGE FOR CONTAINING ELEC...
- Publication number 20150232244
- Publication date Aug 20, 2015
- Neomax Materials Co., Ltd.
- Masayuki Yokota
- B32 - LAYERED PRODUCTS
Information Patent Application
BATTERY TERMINAL, METHOD FOR MANUFACTURING BATTERY TERMINAL, AND BA...
- Publication number 20150086867
- Publication date Mar 26, 2015
- NEOMAX MATERIALS CO., LTD
- Yoshimitsu Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION PLATE FOR BATTERY TERMINALS AND METHOD FOR MANUFACTURING...
- Publication number 20130316217
- Publication date Nov 28, 2013
- Neomax Materials Co., Ltd.
- Yoshimitsu Oda
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
CONNECTION PLATE FOR BATTERY TERMINALS AND METHOD FOR MANUFACTURING...
- Publication number 20130309919
- Publication date Nov 21, 2013
- Neomax Materials Co., Ltd.
- Yoshimitsu Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETIC SEALING CAP
- Publication number 20110048757
- Publication date Mar 3, 2011
- Neomax Materials Co., Ltd.
- Masaharu Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIRTIGHTLY SEALING CAP, ELECTRONIC COMPONENT STORING PACKAGE AND ME...
- Publication number 20100104887
- Publication date Apr 29, 2010
- Neomax Materials Co., Ltd.
- Masaharu Yamamoto
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
HERMETIC SEALING CAP, ELECTRONIC COMPONENT ACCOMMODATION PACKAGE, A...
- Publication number 20090301749
- Publication date Dec 10, 2009
- Neomax Materials Co., Ltd.
- Tsuyoshi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hermetic Sealing Cap, Method of Manufacturing Hermetic Sealing Cap...
- Publication number 20080271908
- Publication date Nov 6, 2008
- NEOMAX MATERIALS CO., LTD.
- Masaharu Yamamoto
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Hermetic sealing cap and method of manufacturing the same
- Publication number 20050023661
- Publication date Feb 3, 2005
- NEOMAX Co., Ltd.
- Shigeji Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder bump transfer sheet, method for producing the same, and meth...
- Publication number 20040149812
- Publication date Aug 5, 2004
- Sumitomo Special Metals Co., Ltd.
- Masaharu Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder bump transfer sheet, method for producing the same, and meth...
- Publication number 20020106883
- Publication date Aug 8, 2002
- Masaharu Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS

Masaharu Yamamoto

Person

Patents Grantslast 30 patents

Method for manufacturing hermetic sealing lid member

Hermetic sealing lid member

Method for manufacturing hermetic sealing lid member, and method fo...

Battery terminal, method for manufacturing battery terminal, and ba...

Battery terminal, method for manufacturing battery terminal, and ba...

Connection plate for battery terminals and method for manufacturing...

Connection plate for battery terminals and method for manufacturing...

Airtightly sealing cap, electronic component storing package and me...

Hermetic sealing cap

Hermetic sealing cap, electronic component accommodation package, a...

Hermetic sealing cap and method of manufacturing the same

Solder bump transfer sheet, method for producing the same, and meth...

Solder bump transfer sheet, method for producing the same, and meth...

Method of producing metal ball and semiconductor package

Polymer, surface modifier for inorganic materials and modified prod...

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING HERMETIC SEALING LID MEMBER

HERMETIC SEALING LID MEMBER AND ELECTRONIC COMPONENT HOUSING PACKAGE

HERMETIC SEALING LID MEMBER, METHOD FOR MANUFACTURING HERMETIC SEAL...

METHOD FOR MANUFACTURING HERMETIC SEALING LID MEMBER, HERMETIC SEAL...

GLASS BONDING MATERIAL AND MULTILAYER GLASS

BATTERY TERMINAL, METHOD FOR MANUFACTURING BATTERY TERMINAL, AND BA...

COVER MATERIAL FOR HERMETIC SEALING AND PACKAGE FOR CONTAINING ELEC...

BATTERY TERMINAL, METHOD FOR MANUFACTURING BATTERY TERMINAL, AND BA...

CONNECTION PLATE FOR BATTERY TERMINALS AND METHOD FOR MANUFACTURING...

CONNECTION PLATE FOR BATTERY TERMINALS AND METHOD FOR MANUFACTURING...

HERMETIC SEALING CAP

AIRTIGHTLY SEALING CAP, ELECTRONIC COMPONENT STORING PACKAGE AND ME...

HERMETIC SEALING CAP, ELECTRONIC COMPONENT ACCOMMODATION PACKAGE, A...

Hermetic Sealing Cap, Method of Manufacturing Hermetic Sealing Cap...

Hermetic sealing cap and method of manufacturing the same

Solder bump transfer sheet, method for producing the same, and meth...

Solder bump transfer sheet, method for producing the same, and meth...