Masahide Kume

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Shimodate-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Adhesive film for circuit connection, and circuit connection structure
- Patent number 7,785,708
- Issue date Aug 31, 2010
- Hitachi Chemical Co., Ltd.
- Takashi Tatsuzawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive film for circuit connection, and circuit connection structure
- Patent number 7,776,438
- Issue date Aug 17, 2010
- Hitachi Chemical Co., Ltd.
- Takashi Tatsuzawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Adhesive film for circuit connection, and circuit connection structure
- Publication number 20080064849
- Publication date Mar 13, 2008
- HITACHI CHEMICAL CO., Ltd.
- Takashi Tatsuzawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Adhesive film for circuit connection, and circuit connection structure
- Publication number 20050151271
- Publication date Jul 14, 2005
- Takashi Tatsuzawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR