MASAHIKO FUJISAWA

Person

HYOGO, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacturing thereof
- Patent number 10,475,883
- Issue date Nov 12, 2019
- Renesas Electronics Corporation
- Masaru Kadoshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,607,956
- Issue date Mar 28, 2017
- Renesas Electronics Corporation
- Masahiro Matsumoto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,406,628
- Issue date Aug 2, 2016
- Renesas Electronics Corporation
- Masahiro Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture thereof
- Patent number 8,169,080
- Issue date May 1, 2012
- Renesas Electronics Corporation
- Noboru Morimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,906,848
- Issue date Mar 15, 2011
- Renesas Electronics Corporation
- Yukihiro Kumagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture thereof
- Patent number 7,884,011
- Issue date Feb 8, 2011
- Renesas Electronics Corporation
- Noboru Morimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture thereof
- Patent number 7,714,413
- Issue date May 11, 2010
- Renesas Technology Corp.
- Noboru Morimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing structure for connecting interconnect lines...
- Patent number 6,780,769
- Issue date Aug 24, 2004
- Renesas Technology Corp.
- Masahiko Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for reducing contact resistance bet...
- Patent number 6,716,731
- Issue date Apr 6, 2004
- Renesas Technology Corp.
- Masahiko Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure for an integrated circuit
- Patent number 6,664,641
- Issue date Dec 16, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Akihiko Ohsaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and its manufacturing method
- Patent number 6,657,265
- Issue date Dec 2, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Masahiko Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for connecting interconnect lines with interposed layer i...
- Patent number 6,624,516
- Issue date Sep 23, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Masahiko Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 6,593,217
- Issue date Jul 15, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Masahiko Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with isolation insulator, interlayer insulatio...
- Patent number 6,472,700
- Issue date Oct 29, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Kazutoshi Wakao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for reducing contact resistance bet...
- Patent number 6,236,090
- Issue date May 22, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Masahiko Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising composite barrier layer
- Patent number 5,565,708
- Issue date Oct 15, 1996
- Mitsubishi Denki Kabushiki Kaisha
- Akihiko Ohsaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER...
- Publication number 20230215784
- Publication date Jul 6, 2023
- RENESAS ELECTRONICS CORPORATION
- Masahiro MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER...
- Publication number 20200211931
- Publication date Jul 2, 2020
- RENESAS ELECTRONICS CORPORATION
- Masahiro MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20180182850
- Publication date Jun 28, 2018
- RENESAS ELECTRONICS CORPORATION
- Masaru KADOSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160268222
- Publication date Sep 15, 2016
- RENESAS ELECTRONICS CORPORATION
- Masahiro Matsumoto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140284790
- Publication date Sep 25, 2014
- RENESAS ELECTRONICS CORPORATION
- Masahiro Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120032323
- Publication date Feb 9, 2012
- Masahiro Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF
- Publication number 20110101530
- Publication date May 5, 2011
- Renesas Technology Corp.
- Noboru MORIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF
- Publication number 20100167525
- Publication date Jul 1, 2010
- Renesas Technology Corp.
- Noboru MORIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20090212437
- Publication date Aug 27, 2009
- Yukihiro Kumagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF
- Publication number 20070090447
- Publication date Apr 26, 2007
- Renesas Technology Corp.
- Noboru MORIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having structure for connecting interconnect l...
- Publication number 20040238963
- Publication date Dec 2, 2004
- RENESAS TECHNOLOGY CORP.
- Masahiko Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure for connecting interconnect lines and method of manufactu...
- Publication number 20030205825
- Publication date Nov 6, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Masahiko Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring structure for an integrated circuit
- Publication number 20030189224
- Publication date Oct 9, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Akihiko Ohsaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnection structure between wires
- Publication number 20030160331
- Publication date Aug 28, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Masahiko Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR CONNECTING INTERCONNECT LINES WITH INTERPOSED LAYER I...
- Publication number 20020171149
- Publication date Nov 21, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Masahiko Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and its manufacturing method
- Publication number 20020109196
- Publication date Aug 15, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Masahiko Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ISOLATION INSULATOR, INTERLAYER INSULATIO...
- Publication number 20020027260
- Publication date Mar 7, 2002
- KAZUTOSHI WAKAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20010015436
- Publication date Aug 23, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Masahiko Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS

MASAHIKO FUJISAWA

Person

Patents Grantslast 30 patents

Semiconductor device and method of manufacturing thereof

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacture thereof

Semiconductor device

Semiconductor device and method of manufacture thereof

Semiconductor device and method of manufacture thereof

Method of manufacturing structure for connecting interconnect lines...

Semiconductor device and method for reducing contact resistance bet...

Wiring structure for an integrated circuit

Semiconductor device and its manufacturing method

Structure for connecting interconnect lines with interposed layer i...

Method of manufacturing semiconductor device

Semiconductor device with isolation insulator, interlayer insulatio...

Semiconductor device and method for reducing contact resistance bet...

Semiconductor device comprising composite barrier layer

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF

Semiconductor device having structure for connecting interconnect l...

Structure for connecting interconnect lines and method of manufactu...

Wiring structure for an integrated circuit

Interconnection structure between wires

STRUCTURE FOR CONNECTING INTERCONNECT LINES WITH INTERPOSED LAYER I...

Semiconductor device and its manufacturing method

SEMICONDUCTOR DEVICE WITH ISOLATION INSULATOR, INTERLAYER INSULATIO...

Semiconductor device and method of manufacturing the same