Masahiko HARAYAMA

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Structures and methods for stack type semiconductor packaging
- Patent number 9,418,940
- Issue date Aug 16, 2016
- Cypress Semiconductor Corporation
- Masataka Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 8,481,366
- Issue date Jul 9, 2013
- Spansion LLC
- Masahiko Harayama
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device having a simplified stack and method for manuf...
- Patent number 8,361,857
- Issue date Jan 29, 2013
- Spansion LLC
- Junji Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a simplified stack and method for manuf...
- Patent number 8,097,961
- Issue date Jan 17, 2012
- Spansion LLC
- Junji Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 8,039,943
- Issue date Oct 18, 2011
- Spansion, LLC
- Masahiko Harayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked solder balls for integrated circuit device packaging and as...
- Patent number 7,846,829
- Issue date Dec 7, 2010
- Spansion LLC
- Junji Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING A SIMPLIFIED STACK AND METHOD FOR MANUF...
- Publication number 20120083096
- Publication date Apr 5, 2012
- Junji TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20110201152
- Publication date Aug 18, 2011
- Masahiko HARAYAMA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A SIMPLIFIED STACK AND METHOD FOR MANUF...
- Publication number 20090321958
- Publication date Dec 31, 2009
- Junji TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20090250800
- Publication date Oct 8, 2009
- Masahiko HARAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SOLDER BALLS FOR INTEGRATED CIRCUIT DEVICE PACKAGING AND AS...
- Publication number 20090212423
- Publication date Aug 27, 2009
- Junji TANAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20090115070
- Publication date May 7, 2009
- Junji TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR STACK TYPE SEMICONDUCTOR PACKAGING
- Publication number 20090115044
- Publication date May 7, 2009
- Masataka HOSHINO
- H01 - BASIC ELECTRIC ELEMENTS

Masahiko HARAYAMA

Person

Patents Grantslast 30 patents

Structures and methods for stack type semiconductor packaging

Semiconductor device and manufacturing method therefor

Semiconductor device having a simplified stack and method for manuf...

Semiconductor device having a simplified stack and method for manuf...

Semiconductor device and manufacturing method therefor

Stacked solder balls for integrated circuit device packaging and as...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE HAVING A SIMPLIFIED STACK AND METHOD FOR MANUF...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR DEVICE HAVING A SIMPLIFIED STACK AND METHOD FOR MANUF...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

STACKED SOLDER BALLS FOR INTEGRATED CIRCUIT DEVICE PACKAGING AND AS...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF

STRUCTURES AND METHODS FOR STACK TYPE SEMICONDUCTOR PACKAGING