Masahiko Hori

Follow

Person

Yokohama-shi, JP

People

Patents Applicationslast 30 patents

Information Patent Application
Method of dividing a wafer which has a low-k film formed on dicing...
- Publication number 20050202650
- Publication date Sep 15, 2005
- Yoshihisa Imori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR