Masahiko Igaue

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Multilayered printed wiring board
- Patent number 8,942,003
- Issue date Jan 27, 2015
- Dai Nippon Printing Co., Ltd.
- Takahiro Sahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered printed wiring board and method for manufacturing the...
- Patent number 8,476,535
- Issue date Jul 2, 2013
- Dai Nippon Printing Co., Ltd.
- Takahiro Sahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered printed wiring board
- Patent number 8,400,776
- Issue date Mar 19, 2013
- Dai Nippon Printing Co., Ltd.
- Takahiro Sahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYERED PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE...
- Publication number 20130220686
- Publication date Aug 29, 2013
- Takahiro Sahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayered printed wiring board and method for manufacturing the...
- Publication number 20110061903
- Publication date Mar 17, 2011
- DAI NIPPON PRINTING CO. , LTD.
- Takahiro Sahara
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Multilayered printed wiring board and method for manufacturing the...
- Publication number 20080049405
- Publication date Feb 28, 2008
- DAI NIPPON PRINTING CO. , LTD.
- Takahiro Sahara
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Multilayered printed wiring board and method for manufacturing the...
- Publication number 20080047737
- Publication date Feb 28, 2008
- DAI NIPPON PRINTING CO. , LTD.
- Takahiro Sahara
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...