Masahiko Ikeya

Person

Sakai-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Bump formation method and bump forming apparatus for semiconductor...
- Patent number 7,516,878
- Issue date Apr 14, 2009
- Panasonic Corporation
- Shoriki Narita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming bumps on a wafer utilizing a post-heating operati...
- Patent number 7,387,229
- Issue date Jun 17, 2008
- Matsushita Electric Industrial Co., Ltd.
- Makoto Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for forming bump
- Patent number 7,350,684
- Issue date Apr 1, 2008
- Matsushita Electric Industrial Co., Ltd.
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump formation method and bump forming apparatus for semiconductor...
- Patent number 7,052,984
- Issue date May 30, 2006
- Matsushita Electric Industrial Co., Ltd.
- Shoriki Narita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for correcting inclination of IC on semiconduc...
- Patent number 7,031,509
- Issue date Apr 18, 2006
- Matsushita Electric Industrial Co., Ltd.
- Shoriki Narita
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Component mounting apparatus and component mounting method
- Patent number 7,021,357
- Issue date Apr 4, 2006
- Matsushita Electric Industrial Co., Ltd.
- Ryoichiro Katano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump forming apparatus for charge appearance semiconductor substrat...
- Patent number 7,014,092
- Issue date Mar 21, 2006
- Matsushita Electric Industrial Co., Ltd.
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BUMP FORMING APPARATUS FOR CHARGE APPEARANCE SEMICONDUCTOR SUBSTRAT...
- Patent number 7,005,368
- Issue date Feb 28, 2006
- Matsushita Electric Industrial Co., Ltd.
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for forming bump
- Patent number 6,910,613
- Issue date Jun 28, 2005
- Matsushita Electric Industrial Co., Ltd.
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE BUMP FORMING DEV...
- Patent number 6,818,975
- Issue date Nov 16, 2004
- Matsushita Electric Industrial Co., Ltd.
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming bumps on a wafer utilizing a post-heating operati...
- Patent number 6,787,391
- Issue date Sep 7, 2004
- Matsushita Electric Industrial Co., Ltd.
- Makoto Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump forming method and bump bonder
- Patent number 6,098,868
- Issue date Aug 8, 2000
- Masushita Electric Industrial Co., Ltd.
- Takaharu Mae
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method of forming bumps on a wafer utilizing a post-heating operati...
- Publication number 20080179378
- Publication date Jul 31, 2008
- Makoto Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump formation method and bump forming apparatus for semiconductor...
- Publication number 20060102701
- Publication date May 18, 2006
- Shoriki Narita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and method for forming bump
- Publication number 20050191838
- Publication date Sep 1, 2005
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming bumps on a wafer utilizing a post-heating operati...
- Publication number 20040149803
- Publication date Aug 5, 2004
- Makoto Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and method for forming bump
- Publication number 20040102030
- Publication date May 27, 2004
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump forming apparatus for charge appearance semiconductor substrat...
- Publication number 20040035849
- Publication date Feb 26, 2004
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump formation method and bump forming apparatus to semiconductor w...
- Publication number 20040020973
- Publication date Feb 5, 2004
- Shoriki Narita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component mounting apparatus and component mounting method
- Publication number 20030070280
- Publication date Apr 17, 2003
- Ryoichiro Katano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for correcting inclination of IC on semiconduc...
- Publication number 20020061129
- Publication date May 23, 2002
- Shoriki Narita
- G06 - COMPUTING CALCULATING COUNTING

Masahiko Ikeya

Person

Patents Grantslast 30 patents

Bump formation method and bump forming apparatus for semiconductor...

Method of forming bumps on a wafer utilizing a post-heating operati...

Apparatus and method for forming bump

Bump formation method and bump forming apparatus for semiconductor...

Method and apparatus for correcting inclination of IC on semiconduc...

Component mounting apparatus and component mounting method

Bump forming apparatus for charge appearance semiconductor substrat...

BUMP FORMING APPARATUS FOR CHARGE APPEARANCE SEMICONDUCTOR SUBSTRAT...

Device and method for forming bump

ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE BUMP FORMING DEV...

Method of forming bumps on a wafer utilizing a post-heating operati...

Bump forming method and bump bonder

Patents Applicationslast 30 patents

Method of forming bumps on a wafer utilizing a post-heating operati...

Bump formation method and bump forming apparatus for semiconductor...

Apparatus and method for forming bump

Method of forming bumps on a wafer utilizing a post-heating operati...

Device and method for forming bump

Bump forming apparatus for charge appearance semiconductor substrat...

Bump formation method and bump forming apparatus to semiconductor w...

Component mounting apparatus and component mounting method

Method and apparatus for correcting inclination of IC on semiconduc...