Masahiko Kitamura

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing semiconductor chip
- Patent number 7,335,578
- Issue date Feb 26, 2008
- Sekisui Chemical Co., Ltd.
- Masateru Fukuoka
- B24 - GRINDING POLISHING
Information Patent Grant
Method for manufacturing semiconductor chip
- Patent number 7,172,950
- Issue date Feb 6, 2007
- Kansai Paint Co., Ltd.
- Kouji Takezoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer protective device and semiconductor wafer treat...
- Patent number 6,943,045
- Issue date Sep 13, 2005
- Disco Corporation
- Masahiko Kitamura
- B24 - GRINDING POLISHING
Information Patent Grant
IC chip manufacturing method
- Patent number 6,939,741
- Issue date Sep 6, 2005
- Sekisui Chemical Co., Ltd.
- Masateru Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer support plate
- Patent number 6,927,416
- Issue date Aug 9, 2005
- Disco Corporation
- Kazuhisa Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Production method for semiconductor chip
- Patent number 6,852,608
- Issue date Feb 8, 2005
- Disco Corporation
- Masahiko Kitamura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IMAGE FORMING APPARATUS
- Publication number 20200353757
- Publication date Nov 12, 2020
- ALPS ALPINE CO., LTD.
- Kazuhiro HONDA
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
IMAGE FORMING APPARATUS
- Publication number 20200269600
- Publication date Aug 27, 2020
- ALPS ALPINE CO., LTD.
- Akira YANAGIDA
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Method for manufacturing semiconductor chip
- Publication number 20040259332
- Publication date Dec 23, 2004
- Masateru Fukuoka
- B24 - GRINDING POLISHING
Information Patent Application
Semiconductor wafer protective device and semiconductor wafer treat...
- Publication number 20040235269
- Publication date Nov 25, 2004
- Masahiko Kitamura
- B24 - GRINDING POLISHING
Information Patent Application
Method for manufacturing semiconductor chip
- Publication number 20040192012
- Publication date Sep 30, 2004
- Kouji Takezoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ic chip manufacturing method
- Publication number 20040185639
- Publication date Sep 23, 2004
- Masateru Fukuoka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Wafer support plate
- Publication number 20040124413
- Publication date Jul 1, 2004
- Kazuhisa Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of processing a semiconductor wafer
- Publication number 20040092108
- Publication date May 13, 2004
- Kouichi Yajima
- B24 - GRINDING POLISHING
Information Patent Application
Production method for semiconductor chip
- Publication number 20040048419
- Publication date Mar 11, 2004
- Masahiko Kitamura
- H01 - BASIC ELECTRIC ELEMENTS

Masahiko Kitamura

Person

Patents Grantslast 30 patents

Method for manufacturing semiconductor chip

Method for manufacturing semiconductor chip

Semiconductor wafer protective device and semiconductor wafer treat...

IC chip manufacturing method

Wafer support plate

Production method for semiconductor chip

Patents Applicationslast 30 patents

IMAGE FORMING APPARATUS

IMAGE FORMING APPARATUS

Method for manufacturing semiconductor chip

Semiconductor wafer protective device and semiconductor wafer treat...

Method for manufacturing semiconductor chip

Ic chip manufacturing method

Wafer support plate

Method of processing a semiconductor wafer

Production method for semiconductor chip