Masahiko Maeda

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor device having reinforcing mem...
- Patent number 6,303,471
- Issue date Oct 16, 2001
- Nippon Telegraph and Telephone Corporation
- Hideyuki Unno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor wafers
- Patent number 6,162,730
- Issue date Dec 19, 2000
- Komatsu Electronic Metals Co., Ltd.
- Fumitaka Kai
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method of manufacturing a semiconductor wafer
- Patent number 6,066,565
- Issue date May 23, 2000
- Komatsu Electronic Metals Co., Ltd.
- Hideyo Kuroki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making semiconductor wafers
- Patent number 6,043,156
- Issue date Mar 28, 2000
- Komatsu Electric Metals Co., Ltd.
- Fumitaka Kai
- C30 - CRYSTAL GROWTH
Information Patent Grant
Template used for polishing a semiconductor wafer
- Patent number 6,001,007
- Issue date Dec 14, 1999
- Komatsu Electronic Metals Co., Ltd.
- Masahiko Maeda
- B24 - GRINDING POLISHING
Information Patent Grant
Method of making semiconductor wafers
- Patent number 5,963,821
- Issue date Oct 5, 1999
- Komatsu Electronic Metal Co., Ltd.
- Fumitaka Kai
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method of manufacturing a semiconductor wafer
- Patent number 5,904,568
- Issue date May 18, 1999
- Komatsu Electronic Metals Co., Ltd.
- Masahiko Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor wafer
- Patent number 5,899,731
- Issue date May 4, 1999
- Komatsu Electronic Metals Co., Ltd.
- Fumitaka Kai
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method for fabricating semiconductor wafers
- Patent number 5,899,743
- Issue date May 4, 1999
- Komatsu Electronic Metals Co., Ltd.
- Fumitaka Kai
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method for fabricating a semiconductor wafer
- Patent number 5,849,636
- Issue date Dec 15, 1998
- Komatsu Electronic Metals Co., Ltd.
- Takamitsu Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making semiconductor wafers and semiconductor wafers made...
- Patent number 5,747,364
- Issue date May 5, 1998
- Komatsu Electronic Metals Co., Ltd.
- Nobuyuki Akiyama
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Tin thin film formation method
- Patent number 5,080,927
- Issue date Jan 14, 1992
- Nippon Telegraph and Telephone Corp.
- Koichi Ikeda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Masahiko Maeda

Person

Patents Grantslast 30 patents

Method of manufacturing semiconductor device having reinforcing mem...

Method for fabricating semiconductor wafers

Method of manufacturing a semiconductor wafer

Method of making semiconductor wafers

Template used for polishing a semiconductor wafer

Method of making semiconductor wafers

Method of manufacturing a semiconductor wafer

Method of fabricating a semiconductor wafer

Method for fabricating semiconductor wafers

Method for fabricating a semiconductor wafer

Method of making semiconductor wafers and semiconductor wafers made...

Tin thin film formation method