Membership
Tour
Register
Log in
Masahiko SUGIYAMA
Follow
Person
Nirasaki-City, Yamanashi, JP
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Joining device and joining position adjustment method using joining...
Patent number
9,263,312
Issue date
Feb 16, 2016
Tokyo Electron Limited
Michikazu Nakamura
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Mounting method and mounting device
Patent number
8,749,068
Issue date
Jun 10, 2014
Tokyo Electron Limited
Michikazu Nakamura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding apparatus and bonding method
Patent number
8,434,538
Issue date
May 7, 2013
Tokyo Electron Limited
Naoki Akiyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for manufacturing three-dimensional integrated...
Patent number
8,349,652
Issue date
Jan 8, 2013
Tokyo Electron Limited
Mitsumasa Koyanagi
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Bonding apparatus and bonding method
Patent number
8,286,853
Issue date
Oct 16, 2012
Tokyo Electron Limited
Naoki Akiyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding apparatus
Patent number
8,210,417
Issue date
Jul 3, 2012
Tokyo Electron Limited
Naoki Akiyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of magnetizing rotor of motor
Patent number
4,748,535
Issue date
May 31, 1988
Hitachi, Ltd.
Noriaki Arawaka
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
BONDING DEVICE, BONDING SYSTEM, AND BONDING METHOD
Publication number
20160001543
Publication date
Jan 7, 2016
TOKYO ELECTRON LIMITED
Naoki AKIYAMA
B32 - LAYERED PRODUCTS
Information
Patent Application
BONDING DEVICE AND BONDING METHOD
Publication number
20150017782
Publication date
Jan 15, 2015
TOKYO ELECTRON LIMITED
Naoki AKIYAMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
JOINING DEVICE AND JOINING POSITION ADJUSTMENT METHOD USING JOINING...
Publication number
20140311653
Publication date
Oct 23, 2014
TOKYO ELECTRON LIMITED
Michikazu Nakamura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOUNTING METHOD AND MOUNTING DEVICE
Publication number
20120291950
Publication date
Nov 22, 2012
TOKYO ELECTRON LIMITED
Masahiko Sugiyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOUNTING METHOD AND MOUNTING DEVICE
Publication number
20120292775
Publication date
Nov 22, 2012
TOKYO ELECTRON LIMITED
Michikazu Nakamura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING APPARATUS AND BONDING METHOD
Publication number
20120103533
Publication date
May 3, 2012
TOKYO ELECTRON LIMITED
Naoki AKIYAMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING APPARATUS
Publication number
20120091186
Publication date
Apr 19, 2012
TOKYO ELECTRON LIMITED
Naoki AKIYAMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING APPARATUS AND BONDING METHOD
Publication number
20120091187
Publication date
Apr 19, 2012
TOKYO ELECTRON LIMITED
Naoki AKIYAMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND APPARATUS FOR MANUFACTURING THREE-DIMENSIONAL INTEGRATED...
Publication number
20120021563
Publication date
Jan 26, 2012
TOHOKU UNIVERSITY
Mitsumasa Koyanagi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING APPARATUS AND BONDING METHOD
Publication number
20110214809
Publication date
Sep 8, 2011
TOKYO ELECTRON LIMITED
Masahiko Sugiyama
B32 - LAYERED PRODUCTS