Masahiko SUGIYAMA

Person

Nirasaki-City, Yamanashi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Joining device and joining position adjustment method using joining...
- Patent number 9,263,312
- Issue date Feb 16, 2016
- Tokyo Electron Limited
- Michikazu Nakamura
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Mounting method and mounting device
- Patent number 8,749,068
- Issue date Jun 10, 2014
- Tokyo Electron Limited
- Michikazu Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 8,434,538
- Issue date May 7, 2013
- Tokyo Electron Limited
- Naoki Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for manufacturing three-dimensional integrated...
- Patent number 8,349,652
- Issue date Jan 8, 2013
- Tokyo Electron Limited
- Mitsumasa Koyanagi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 8,286,853
- Issue date Oct 16, 2012
- Tokyo Electron Limited
- Naoki Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus
- Patent number 8,210,417
- Issue date Jul 3, 2012
- Tokyo Electron Limited
- Naoki Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of magnetizing rotor of motor
- Patent number 4,748,535
- Issue date May 31, 1988
- Hitachi, Ltd.
- Noriaki Arawaka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING DEVICE, BONDING SYSTEM, AND BONDING METHOD
- Publication number 20160001543
- Publication date Jan 7, 2016
- TOKYO ELECTRON LIMITED
- Naoki AKIYAMA
- B32 - LAYERED PRODUCTS
Information Patent Application
BONDING DEVICE AND BONDING METHOD
- Publication number 20150017782
- Publication date Jan 15, 2015
- TOKYO ELECTRON LIMITED
- Naoki AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINING DEVICE AND JOINING POSITION ADJUSTMENT METHOD USING JOINING...
- Publication number 20140311653
- Publication date Oct 23, 2014
- TOKYO ELECTRON LIMITED
- Michikazu Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING METHOD AND MOUNTING DEVICE
- Publication number 20120291950
- Publication date Nov 22, 2012
- TOKYO ELECTRON LIMITED
- Masahiko Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING METHOD AND MOUNTING DEVICE
- Publication number 20120292775
- Publication date Nov 22, 2012
- TOKYO ELECTRON LIMITED
- Michikazu Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20120103533
- Publication date May 3, 2012
- TOKYO ELECTRON LIMITED
- Naoki AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS
- Publication number 20120091186
- Publication date Apr 19, 2012
- TOKYO ELECTRON LIMITED
- Naoki AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20120091187
- Publication date Apr 19, 2012
- TOKYO ELECTRON LIMITED
- Naoki AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR MANUFACTURING THREE-DIMENSIONAL INTEGRATED...
- Publication number 20120021563
- Publication date Jan 26, 2012
- TOHOKU UNIVERSITY
- Mitsumasa Koyanagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20110214809
- Publication date Sep 8, 2011
- TOKYO ELECTRON LIMITED
- Masahiko Sugiyama
- B32 - LAYERED PRODUCTS

Masahiko SUGIYAMA

Person

Patents Grantslast 30 patents

Joining device and joining position adjustment method using joining...

Mounting method and mounting device

Bonding apparatus and bonding method

Method and apparatus for manufacturing three-dimensional integrated...

Bonding apparatus and bonding method

Bonding apparatus

Method of magnetizing rotor of motor

Patents Applicationslast 30 patents

BONDING DEVICE, BONDING SYSTEM, AND BONDING METHOD

BONDING DEVICE AND BONDING METHOD

JOINING DEVICE AND JOINING POSITION ADJUSTMENT METHOD USING JOINING...

MOUNTING METHOD AND MOUNTING DEVICE

MOUNTING METHOD AND MOUNTING DEVICE

BONDING APPARATUS AND BONDING METHOD

BONDING APPARATUS

BONDING APPARATUS AND BONDING METHOD

METHOD AND APPARATUS FOR MANUFACTURING THREE-DIMENSIONAL INTEGRATED...

BONDING APPARATUS AND BONDING METHOD