Masahiro Aoyagi

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic circuit connection method and electronic circuit
- Patent number 11,270,968
- Issue date Mar 8, 2022
- National Institute of Advanced Industrial Science and Technology
- Masaru Hashino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode, manufacturing method thereof, and semiconductor...
- Patent number 9,984,956
- Issue date May 29, 2018
- National Institute of Advanced Industrial Science and Technology
- Masahiro Aoyagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode, manufacturing method thereof, and semiconductor...
- Patent number 9,818,645
- Issue date Nov 14, 2017
- National Institute of Advanced Industrial Science and Technology
- Masahiro Aoyagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor devi...
- Patent number 9,627,347
- Issue date Apr 18, 2017
- National Institute of Advanced Industrial Science and Technology
- Masahiro Aoyagi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroless gold plating solution for forming fine gold structure,...
- Patent number 9,345,145
- Issue date May 17, 2016
- Kanto Kagaku Kabushiki Kaisha
- Ryota Iwai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of making contact probe
- Patent number 9,134,346
- Issue date Sep 15, 2015
- National Institute of Advanced Industrial Science and Technology
- Masahiro Aoyagi
- G01 - MEASURING TESTING
Information Patent Grant
Electrode connection structure of semiconductor chip, conductive me...
- Patent number 8,399,979
- Issue date Mar 19, 2013
- National Institute of Advanced Industrial Science and Technology
- Yasuhiro Yamaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode connection structure of semiconductor chip, conductive me...
- Patent number 8,367,468
- Issue date Feb 5, 2013
- National Institute of Advanced Industrial Science and Technology
- Yasuhiro Yamaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact probe and method of making the same
- Patent number 7,990,165
- Issue date Aug 2, 2011
- National Institute of Advanced Industrial Science and Technology
- Masahiro Aoyagi
- G01 - MEASURING TESTING
Information Patent Grant
Multi-layer fin wiring interposer fabrication process
- Patent number 7,833,835
- Issue date Nov 16, 2010
- National Institute of Advanced Industrial Science and Technology
- Masahiro Aoyagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming micro metal bump
- Patent number 7,767,574
- Issue date Aug 3, 2010
- Kabushiki Kaisha Mikuni Kogyo
- Yoshihiro Gomi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System in-package test inspection apparatus and test inspection method
- Patent number 7,414,422
- Issue date Aug 19, 2008
- National Institute of Advanced Industrial Science and Technology
- Masahiro Aoyagi
- G01 - MEASURING TESTING
Information Patent Grant
Superconducting integrated circuit and method for fabrication thereof
- Patent number 7,323,348
- Issue date Jan 29, 2008
- National Institute of Advanced Industrial Science and Technology
- Masahiro Aoyagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact probe, measuring pad used for the contact probe, and method...
- Patent number 7,227,352
- Issue date Jun 5, 2007
- National Institute of Advanced Industrial Science and Technology
- Masahiro Aoyagi
- G01 - MEASURING TESTING
Information Patent Grant
Contact probe, measuring pad used for the contact probe, and method...
- Patent number 7,208,966
- Issue date Apr 24, 2007
- National Institute of Advanced Industrial Science and Technology
- Masahiro Aoyagi
- G01 - MEASURING TESTING
Information Patent Grant
Superconducting integrated circuit and method for fabrication thereof
- Patent number 6,911,665
- Issue date Jun 28, 2005
- National Institute of Advanced Industrial Science and Technology
- Masahiro Aoyagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elementary cell for constructing asynchronous superconducting logic...
- Patent number 5,598,105
- Issue date Jan 28, 1997
- Agency of Industrial Science & Technology, Ministry of International Trade &...
- Itaru Kurosawa
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Josephson memory circuit
- Patent number 5,260,264
- Issue date Nov 9, 1993
- Agency of Industrial Science and Technology
- Itaru Kurosawa
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC CIRCUIT CONNECTION METHOD AND ELECTRONIC CIRCUIT
- Publication number 20210249374
- Publication date Aug 12, 2021
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Masaru HASHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH ELECTRODE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR...
- Publication number 20170200644
- Publication date Jul 13, 2017
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Masahiro AOYAGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH ELECTRODE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR...
- Publication number 20160322282
- Publication date Nov 3, 2016
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Masahiro AOYAGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing Semiconductor Device and Semiconductor Devi...
- Publication number 20150235984
- Publication date Aug 20, 2015
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Masahiro Aoyagi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROLESS GOLD PLATING SOLUTION FOR FORMING FINE GOLD STRUCTURE,...
- Publication number 20120119352
- Publication date May 17, 2012
- Kanto Kagaku Kabushiki Kaisha
- Ryota Iwai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTRODE CONNECTION STRUCTURE OF SEMICONDUCTOR CHIP, CONDUCTIVE ME...
- Publication number 20120108008
- Publication date May 3, 2012
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Yasuhiro Yamaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING CONTACT PROBE
- Publication number 20110247209
- Publication date Oct 13, 2011
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Masahiro Aoyagi
- G01 - MEASURING TESTING
Information Patent Application
Electrode connection structure of semiconductor chip, conductive me...
- Publication number 20100044870
- Publication date Feb 25, 2010
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Yasuhiro Yamaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT PROVE AND METHOD OF MAKING THE SAME
- Publication number 20090224781
- Publication date Sep 10, 2009
- SHINWA FRONTECH CORP.
- Masahiro Aoyagi
- G01 - MEASURING TESTING
Information Patent Application
Method of Forming Micro Metal Bump
- Publication number 20090104766
- Publication date Apr 23, 2009
- Yoshihiro Gomi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-layer fin wiring interposer fabrication process
- Publication number 20080044950
- Publication date Feb 21, 2008
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCI & TECH
- Masahiro Aoyagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact probe, measuring pad used for the contact probe, and method...
- Publication number 20070065956
- Publication date Mar 22, 2007
- NAT'L INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Masahiro Aoyagi
- G01 - MEASURING TESTING
Information Patent Application
Contact probe, measuring pad used for the contact probe, and method...
- Publication number 20050264313
- Publication date Dec 1, 2005
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Masahiro Aoyagi
- G01 - MEASURING TESTING
Information Patent Application
System in-package test inspection apparatus and test inspection method
- Publication number 20050236717
- Publication date Oct 27, 2005
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Masahiro Aoyagi
- G01 - MEASURING TESTING
Information Patent Application
Superconducting integrated circuit and method for fabrication thereof
- Publication number 20050191763
- Publication date Sep 1, 2005
- Nat'l Inst of Advance Indust Science & Tech (80%)
- Masahiro Aoyagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-layer fine wiring interposer and manufacturing method thereof
- Publication number 20040256727
- Publication date Dec 23, 2004
- Masahiro Aoyagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Superconducting integrated circuit and method for fabrication thereof
- Publication number 20040056335
- Publication date Mar 25, 2004
- Nat'l Inst of Adv Industrial Sci and Tech
- Masahiro Aoyagi
- H01 - BASIC ELECTRIC ELEMENTS

Masahiro Aoyagi

Person

Patents Grantslast 30 patents

Electronic circuit connection method and electronic circuit

Through electrode, manufacturing method thereof, and semiconductor...

Through electrode, manufacturing method thereof, and semiconductor...

Method of manufacturing semiconductor device and semiconductor devi...

Electroless gold plating solution for forming fine gold structure,...

Method of making contact probe

Electrode connection structure of semiconductor chip, conductive me...

Electrode connection structure of semiconductor chip, conductive me...

Contact probe and method of making the same

Multi-layer fin wiring interposer fabrication process

Method of forming micro metal bump

System in-package test inspection apparatus and test inspection method

Superconducting integrated circuit and method for fabrication thereof

Contact probe, measuring pad used for the contact probe, and method...

Contact probe, measuring pad used for the contact probe, and method...

Superconducting integrated circuit and method for fabrication thereof

Elementary cell for constructing asynchronous superconducting logic...

Josephson memory circuit

Patents Applicationslast 30 patents

ELECTRONIC CIRCUIT CONNECTION METHOD AND ELECTRONIC CIRCUIT

THROUGH ELECTRODE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR...

THROUGH ELECTRODE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR...

Method of Manufacturing Semiconductor Device and Semiconductor Devi...

ELECTROLESS GOLD PLATING SOLUTION FOR FORMING FINE GOLD STRUCTURE,...

ELECTRODE CONNECTION STRUCTURE OF SEMICONDUCTOR CHIP, CONDUCTIVE ME...

METHOD OF MAKING CONTACT PROBE

Electrode connection structure of semiconductor chip, conductive me...

CONTACT PROVE AND METHOD OF MAKING THE SAME

Method of Forming Micro Metal Bump

Multi-layer fin wiring interposer fabrication process

Contact probe, measuring pad used for the contact probe, and method...

Contact probe, measuring pad used for the contact probe, and method...

System in-package test inspection apparatus and test inspection method

Superconducting integrated circuit and method for fabrication thereof

Multi-layer fine wiring interposer and manufacturing method thereof

Superconducting integrated circuit and method for fabrication thereof