Masahiro Funayama

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Device manufactured by room-temperature bonding, device manufacturi...
- Patent number 10,112,376
- Issue date Oct 30, 2018
- MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL, CO., LTD.
- Jun Utsumi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufcaturing method for room-temperature substrate bonding
- Patent number 8,936,998
- Issue date Jan 20, 2015
- Mitsubishi Heavy Industries, Ltd.
- Jun Utsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Room-temperature bonding method and room-temperature bonding appara...
- Patent number 8,608,048
- Issue date Dec 17, 2013
- Mitsubishi Heavy Industries, Ltd.
- Takayuki Goto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Room temperature bonding using sputtering
- Patent number 8,602,289
- Issue date Dec 10, 2013
- Mitsubishi Heavy Industries, Ltd.
- Takayuki Goto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor element module and method for manufacturing the same
- Patent number 8,222,724
- Issue date Jul 17, 2012
- Mitsubishi Heavy Industries, Ltd.
- Daishi Ueno
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DEVICE MANUFACTURED BY ROOM-TEMPERATURE BONDING, DEVICE MANUFACTURI...
- Publication number 20160250838
- Publication date Sep 1, 2016
- MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL CO., LTD.
- Jun UTSUMI
- B32 - LAYERED PRODUCTS
Information Patent Application
DEVICE AND DEVICE MANUFACTURE METHOD
- Publication number 20130213561
- Publication date Aug 22, 2013
- Jun UTSUMI
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
ROOM-TEMPERATURE BONDING METHOD AND ROOM-TEMPERATURE BONDING APPARATUS
- Publication number 20110214816
- Publication date Sep 8, 2011
- Takayuki Goto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR ELEMENT MODULE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110062600
- Publication date Mar 17, 2011
- Daishi Ueno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND DEVICE MANUFACTURE METHOD
- Publication number 20100276723
- Publication date Nov 4, 2010
- MITSUBUISHI HEAVY INDUSTRIES, LTD.
- Jun Utsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE MANUFACTURED BY ROOM-TEMPERATURE BONDING, DEVICE MANUFACTURI...
- Publication number 20100092786
- Publication date Apr 15, 2010
- Mitsubishi Heavy Industries, Ltd.
- Jun Utsumi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROOM-TEMPERATURE BONDING METHOD AND ROOM-TEMPERATURE BONDING APPARATUS
- Publication number 20100000663
- Publication date Jan 7, 2010
- Takayuki Goto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Masahiro Funayama

Person

Patents Grantslast 30 patents

Device manufactured by room-temperature bonding, device manufacturi...

Manufcaturing method for room-temperature substrate bonding

Room-temperature bonding method and room-temperature bonding appara...

Room temperature bonding using sputtering

Semiconductor element module and method for manufacturing the same

Patents Applicationslast 30 patents

DEVICE MANUFACTURED BY ROOM-TEMPERATURE BONDING, DEVICE MANUFACTURI...

DEVICE AND DEVICE MANUFACTURE METHOD

ROOM-TEMPERATURE BONDING METHOD AND ROOM-TEMPERATURE BONDING APPARATUS

SEMICONDUCTOR ELEMENT MODULE AND METHOD FOR MANUFACTURING THE SAME

DEVICE AND DEVICE MANUFACTURE METHOD

DEVICE MANUFACTURED BY ROOM-TEMPERATURE BONDING, DEVICE MANUFACTURI...

ROOM-TEMPERATURE BONDING METHOD AND ROOM-TEMPERATURE BONDING APPARATUS