Masahiro Furo

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a metal-ceramic circuit board
- Patent number 7,487,585
- Issue date Feb 10, 2009
- Dowa Metaltech Co., Ltd.
- Hideyo Osanai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal-ceramic circuit board
- Patent number 7,348,493
- Issue date Mar 25, 2008
- Dowa Mining Co., Ltd.
- Hideyo Osanai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulating substrate boards for semiconductor and power modules
- Patent number 7,276,292
- Issue date Oct 2, 2007
- Dowa Mining Co., Ltd.
- Masahiro Furo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a metal-ceramic circuit board
- Patent number 6,938,333
- Issue date Sep 6, 2005
- Dowa Mining Co., Ltd.
- Hideyo Osanai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing shape strips of metals
- Patent number 5,174,363
- Issue date Dec 29, 1992
- Dowa Mining Co., Ltd.
- Masahiro Furo
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Method for bonding copper plate to alumina substrate and process fo...
- Patent number 4,811,893
- Issue date Mar 14, 1989
- Dowa Mining Co., Ltd.
- Naoyuki Kanahara
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Patents Applicationslast 30 patents

Information Patent Application
Method of manufacturing a metal-ceramic circuit board
- Publication number 20060242826
- Publication date Nov 2, 2006
- DOWA MINING CO., LTD.
- Hideyo Osanai
- B32 - LAYERED PRODUCTS
Information Patent Application
Method of manufacturing a metal-ceramic circuit board
- Publication number 20050138799
- Publication date Jun 30, 2005
- DOWA MINING CO., LTD.
- Hideyo Osanai
- B32 - LAYERED PRODUCTS
Information Patent Application
Method of manufacturing a metal-ceramic circuit board
- Publication number 20030037434
- Publication date Feb 27, 2003
- DOWA MINING CO., LTD.
- Hideyo Osanai
- B32 - LAYERED PRODUCTS
Information Patent Application
Insulating substrate boards for semiconductor and power modules
- Publication number 20020164488
- Publication date Nov 7, 2002
- DOWA MINING CO., LTD.
- Masahiro Furo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal-ceramic circuit board and manufacturing method thereof
- Publication number 20020050510
- Publication date May 2, 2002
- DOWA MINING CO., LTD.
- Hideyo Osanai
- B32 - LAYERED PRODUCTS