Masahiro Gooda

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Hitachi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming a number of solder layers on a semiconductor wafer
- Patent number 4,503,597
- Issue date Mar 12, 1985
- Hitachi, Ltd.
- Tadao Kushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal fatigue resistant low-melting point solder alloys
- Patent number 4,491,562
- Issue date Jan 1, 1985
- Hitachi, Ltd.
- Tasao Soga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR