Masahiro HONDA

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Okazaki-city, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,236,276
- Issue date Jan 12, 2016
- Denso Corporation
- Koji Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of molded package
- Patent number 9,087,794
- Issue date Jul 21, 2015
- Denso Corporation
- Masahiro Honda
- G01 - MEASURING TESTING
Information Patent Grant
Sensor device and manufacturing method thereof
- Patent number 8,334,158
- Issue date Dec 18, 2012
- Denso Corporation
- Toshihiko Takahata
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250118621
- Publication date Apr 10, 2025
- DENSO CORPORATION
- MOTOMI MUROZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240079290
- Publication date Mar 7, 2024
- DENSO CORPORATION
- MOTOMI MUROZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240071862
- Publication date Feb 29, 2024
- DENSO CORPORATION
- YOSHIFUMI MUNAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140315356
- Publication date Oct 23, 2014
- Koji Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF MOLDED PACKAGE
- Publication number 20130011970
- Publication date Jan 10, 2013
- DENSO CORPORATION
- Masahiro Honda
- G01 - MEASURING TESTING
Information Patent Application
SENSOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20100224945
- Publication date Sep 9, 2010
- DENSO CORPORATION
- Toshihiko TAKAHATA
- B81 - MICRO-STRUCTURAL TECHNOLOGY