Masahiro Ishibashi

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Minato-ku, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wiring board, semiconductor device, and method for manufacturing wi...
- Patent number 8,058,565
- Issue date Nov 15, 2011
- NEC Corporation
- Yukihiro Kiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulation material of reactive elastomer, epoxy resin, curing agen...
- Patent number 7,981,963
- Issue date Jul 19, 2011
- NEC Corporation
- Yukihiro Kiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING WI...
- Publication number 20070274060
- Publication date Nov 29, 2007
- Yukihiro Kiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATION MATERIAL, WIRING BOARD, AND SEMICONDUCTOR DEVICE
- Publication number 20070251721
- Publication date Nov 1, 2007
- NEC Corporation
- Yukihiro Kiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and printed wiring board having electrode pads
- Publication number 20030121698
- Publication date Jul 3, 2003
- NEC Corporation
- Yoshitaka Kyougoku
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...