Masahiro Ishitsuka

Follow

Person

Fukuoka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Die bonding device and semiconductor device
- Patent number 6,347,655
- Issue date Feb 19, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Masahiko Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, and a manufacturing apparatus for a method of...
- Patent number 6,320,259
- Issue date Nov 20, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Shunji Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-molded semiconductor device and lead frame employed for fabri...
- Patent number 5,291,059
- Issue date Mar 1, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Masahiro Ishitsuka
- H01 - BASIC ELECTRIC ELEMENTS