Masahiro KANETA

Person

Annaka-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for producing power module, and power module
- Patent number 11,984,327
- Issue date May 14, 2024
- Shin-Etsu Chemical Co., Ltd.
- Naoyuki Kushihara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMALLY CONDUCTIVE RESIN COMPOSITION
- Publication number 20230250328
- Publication date Aug 10, 2023
- Shin-Etsu Chemical Co., Ltd.
- Naoyuki KUSHIHARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HEAT-CURABLE EPOXY RESIN COMPOSITION AND HEAT-CURABLE EPOXY RESIN S...
- Publication number 20230159743
- Publication date May 25, 2023
- Shin-Etsu Chemical Co., Ltd.
- Naoyuki KUSHIHARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR PRODUCING POWER MODULE, AND POWER MODULE
- Publication number 20220068667
- Publication date Mar 3, 2022
- Shin-Etsu Chemical Co., Ltd.
- Naoyuki KUSHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICON...
- Publication number 20210002474
- Publication date Jan 7, 2021
- Shin-Etsu Chemical Co., Ltd.
- Shoichi OSADA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Semiconductor Encapsulating Resin Composition and Semiconductor Device
- Publication number 20190127580
- Publication date May 2, 2019
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HEAT-CURABLE SILICONE RESIN COMPOSITION, OPTICAL SEMICONDUCTOR DEVI...
- Publication number 20170088710
- Publication date Mar 30, 2017
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- H01 - BASIC ELECTRIC ELEMENTS

Masahiro KANETA

Person

Patents Grantslast 30 patents

Method for producing power module, and power module

Patents Applicationslast 30 patents

THERMALLY CONDUCTIVE RESIN COMPOSITION

HEAT-CURABLE EPOXY RESIN COMPOSITION AND HEAT-CURABLE EPOXY RESIN S...

METHOD FOR PRODUCING POWER MODULE, AND POWER MODULE

EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICON...

Semiconductor Encapsulating Resin Composition and Semiconductor Device

HEAT-CURABLE SILICONE RESIN COMPOSITION, OPTICAL SEMICONDUCTOR DEVI...