Masahiro Kato

Person

Komaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Photographing apparatus and authentication apparatus
- Patent number 12,217,469
- Issue date Feb 4, 2025
- Hitachi, Ltd.
- Yusuke Matsuda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Observation control device and spacecraft, observation control meth...
- Patent number 12,157,582
- Issue date Dec 3, 2024
- Mitsubishi Heavy Industries, Ltd.
- Masahiro Kato
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Two-pack curable composition set, thermally conductive cured produc...
- Patent number 11,915,993
- Issue date Feb 27, 2024
- DENKA COMPANY LIMITED
- Masahiro Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing multilayer wiring board
- Patent number 11,291,124
- Issue date Mar 29, 2022
- Lincstech Co., Ltd.
- Yuto Tanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer wiring board
- Patent number 11,240,915
- Issue date Feb 1, 2022
- Lincstech Co., Ltd.
- Masahiro Kato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multichip module and electronic device
- Patent number 11,183,483
- Issue date Nov 23, 2021
- Mitsubishi Heavy Industries, Ltd.
- Masahiro Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,833,673
- Issue date Nov 10, 2020
- Mitsubishi Heavy Industries, Ltd.
- Daisuke Matsuura
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Multichip module including surface mounting part embedded therein
- Patent number 10,651,150
- Issue date May 12, 2020
- Mitsubishi Heavy Industries, Ltd.
- Masahiro Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aerospace vehicle system
- Patent number 10,501,210
- Issue date Dec 10, 2019
- Mitsubishi Heavy Industries, Ltd.
- Yoshikatsu Kuroda
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Grant
Power module and air conditioner
- Patent number 10,474,178
- Issue date Nov 12, 2019
- Mitsubishi Electric Corporation
- Masahiro Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid laser amplification device
- Patent number 10,290,991
- Issue date May 14, 2019
- Mitsubishi Heavy Industries, Ltd.
- Yoshiyuki Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor wafer and method for manufacturing bonded semi...
- Patent number 10,283,401
- Issue date May 7, 2019
- Shin-Etsu Handotai Co., Ltd.
- Osamu Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid laser amplification device
- Patent number 10,236,655
- Issue date Mar 19, 2019
- Mitsubishi Heavy Industries, Ltd.
- Yoshiyuki Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat treatment method
- Patent number 9,922,842
- Issue date Mar 20, 2018
- Shin-Etsu Handotai Co., Ltd.
- Masahiro Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing bonded wafer
- Patent number 9,673,086
- Issue date Jun 6, 2017
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device
- Patent number D783550
- Issue date Apr 11, 2017
- Mitsubishi Electric Corporation
- Maki Hasegawa
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Power semiconductor device
- Patent number D777124
- Issue date Jan 24, 2017
- Mitsubishi Electric Corporation
- Maki Hasegawa
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Power semiconductor device
- Patent number D772182
- Issue date Nov 22, 2016
- Mitsubishi Electric Corporation
- Maki Hasegawa
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Power semiconductor device
- Patent number D770994
- Issue date Nov 8, 2016
- Mitsubishi Electric Corporation
- Maki Hasegawa
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Semiconductor module and boost rectifier circuit
- Patent number 9,479,049
- Issue date Oct 25, 2016
- Mitsubishi Electric Corporation
- Shinji Sakai
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for manufacturing a bonded SOI wafer
- Patent number 9,076,840
- Issue date Jul 7, 2015
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing SOI wafer
- Patent number 8,956,951
- Issue date Feb 17, 2015
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon epitaxial wafer, method for manufacturing the same, bonded...
- Patent number 8,823,130
- Issue date Sep 2, 2014
- Shin-Etsu Handotai Co., Ltd.
- Masahiro Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compton camera
- Patent number 8,742,360
- Issue date Jun 3, 2014
- National University Corporation Gunma University
- Mitsutaka Yamaguchi
- G01 - MEASURING TESTING
Information Patent Grant
Method for producing bonded wafer
- Patent number 8,691,665
- Issue date Apr 8, 2014
- Shin-Etsu Handotai Co., Ltd.
- Satoshi Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 8,643,026
- Issue date Feb 4, 2014
- Mitsubishi Electric Corporation
- Masahiro Kato
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method of recommending information, system thereof, and server
- Patent number 8,635,241
- Issue date Jan 21, 2014
- Hitachi, Ltd.
- Yasuhide Mori
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Video content viewing apparatus
- Patent number 8,413,192
- Issue date Apr 2, 2013
- Hitachi, Ltd.
- Masahiro Kato
- G11 - INFORMATION STORAGE
Information Patent Grant
Infrared detector, infrared detecting apparatus, and method of manu...
- Patent number 8,367,452
- Issue date Feb 5, 2013
- Mitsubishi Heavy Industries, Ltd.
- Fumihito Soma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for user interface, display device, and user interface system
- Patent number 8,095,890
- Issue date Jan 10, 2012
- Hitachi, Ltd.
- Nobuhiro Sekimoto
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
POLYMER LATEX COMPOSITION, IMMERSION MOLDED BODY, AND METHOD FOR PR...
- Publication number 20250034371
- Publication date Jan 30, 2025
- Denka Company Limited
- Masahiro KATO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
BLOOD COLLECTION SYSTEM AND BLOOD COLLECTION METHOD
- Publication number 20240398297
- Publication date Dec 5, 2024
- Hitachi, Ltd
- Masahiro KATO
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
CHLOROPRENE-BASED POLYMER LATEX COMPOSITION, AND DIP-MOLDED ARTICLE
- Publication number 20240384067
- Publication date Nov 21, 2024
- DENKA COMPANY LIMITED
- Misaki ITO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CHLOROPRENE POLYMER AND MANUFACTURING METHOD THEREFOR, CHLOROPRENE...
- Publication number 20240294686
- Publication date Sep 5, 2024
- Denka Company Limited
- Misaki ITO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CHLOROPRENE POLYMER LATEX COMPOSITION, AND DIP MOLDED BODY
- Publication number 20240294741
- Publication date Sep 5, 2024
- Denka Company Limited
- Misaki ITO
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
CHLOROPRENE POLYMER LATEX AND MANUFACTURING METHOD THEREFOR, AND DI...
- Publication number 20240294742
- Publication date Sep 5, 2024
- Denka Company Limited
- Misaki ITO
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
CHLOROPRENE POLYMER COMPOSITION, DIP-MOLDED ARTICLE, AND METHOD FOR...
- Publication number 20240034862
- Publication date Feb 1, 2024
- Denka Company Limited
- Masahiro KATO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CHLOROPRENE POLYMER COMPOSITION, MANUFACTURING METHOD THEREFOR, AND...
- Publication number 20230416509
- Publication date Dec 28, 2023
- Denka Company Limited
- Misaki ITO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CONTACTLESS BIOMETRIC AUTHENTICATION DEVICE, CONTACTLESS BIOMETRIC...
- Publication number 20230401888
- Publication date Dec 14, 2023
- Hitachi Industry & Control Solutions, Ltd.
- Yo NONOMURA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PHOTOGRAPHING APPARATUS AND AUTHENTICATION APPARATUS
- Publication number 20230281284
- Publication date Sep 7, 2023
- Hitachi, Ltd
- Yusuke MATSUDA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TWO-AGENT CURABLE HEAT CONDUCTIVE GREASE COMPOSITION, HEAT CONDUCTI...
- Publication number 20230272218
- Publication date Aug 31, 2023
- Denka Company Limited
- Masahiro KATO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
TWO-PACK CURABLE COMPOSITION SET, THERMALLY CONDUCTIVE CURED PRODUC...
- Publication number 20210407885
- Publication date Dec 30, 2021
- Denka Company Limited
- Masahiro KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OBSERVATION CONTROL DEVICE AND SPACECRAFT, OBSERVATION CONTROL METH...
- Publication number 20210163154
- Publication date Jun 3, 2021
- Mitsubishi Heavy Industries, Ltd.
- Masahiro KATO
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Application
INFORMATION PROCESSING SYSTEM AND SEARCH METHOD
- Publication number 20210158903
- Publication date May 27, 2021
- Hitachi, Ltd
- Masahiro KATO
Information Patent Application
ELECTRIC MOTOR AND VENTILATING FAN
- Publication number 20210119513
- Publication date Apr 22, 2021
- MITSUBISHI ELECTRIC CORPORATION
- Junji OKADA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
MULTICHIP MODULE, ELECTRONIC DEVICE AND MANUFACTURING METHOD OF MUL...
- Publication number 20200273845
- Publication date Aug 27, 2020
- Mitsubishi Heavy Industries, Ltd.
- Masahiro KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200007124
- Publication date Jan 2, 2020
- Mitsubishi Heavy Industries, Ltd.
- Daisuke MATSUURA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD
- Publication number 20190350083
- Publication date Nov 14, 2019
- HITACHI CHEMICAL COMPANY, LTD.
- Masahiro KATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD
- Publication number 20190313536
- Publication date Oct 10, 2019
- HITACHI CHEMICAL COMPANY, LTD.
- Yuto TANABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLID LASER AMPLIFICATION DEVICE
- Publication number 20180145474
- Publication date May 24, 2018
- Mitsubishi Heavy Industries, Ltd.
- Yoshiyuki KONDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID LASER AMPLIFICATION DEVICE
- Publication number 20180145473
- Publication date May 24, 2018
- Mitsubishi Heavy Industries, Ltd.
- Yoshiyuki KONDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD AND BONDED BODY
- Publication number 20180082973
- Publication date Mar 22, 2018
- Mitsubishi Heavy Industries, Ltd.
- Masahiro KATO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDED SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURING BONDED SEMI...
- Publication number 20180033681
- Publication date Feb 1, 2018
- Shin-Etsu Handotai Co., Ltd.
- Osamu ISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP MODULE, ON BOARD COMPUTER, SENSOR INTERFACE SUBSTRATE, AN...
- Publication number 20170025383
- Publication date Jan 26, 2017
- Mitsubishi Heavy Industries, Ltd.
- Masahiro KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND AIR CONDITIONER
- Publication number 20160299523
- Publication date Oct 13, 2016
- Mitsubishi Electric Corporation
- Masahiro KATO
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
HEAT TREATMENT METHOD
- Publication number 20160233107
- Publication date Aug 11, 2016
- Shin-Etsu Handotai Co., Ltd.
- Masahiro KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING BONDED WAFER
- Publication number 20160197007
- Publication date Jul 7, 2016
- Shin-Etsu Handotai Co., Ltd.
- Isao YOKOKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A BONDED SOI WAFER
- Publication number 20140322895
- Publication date Oct 30, 2014
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND BOOST RECTIFIER CIRCUIT
- Publication number 20140247030
- Publication date Sep 4, 2014
- Mitsubishi Electric Corporation
- Shinji SAKAI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
POWER MODULE AND AIR CONDITIONER
- Publication number 20130214746
- Publication date Aug 22, 2013
- Masahiro KATO
- H01 - BASIC ELECTRIC ELEMENTS

Masahiro Kato

Person

Patents Grantslast 30 patents

Photographing apparatus and authentication apparatus

Observation control device and spacecraft, observation control meth...

Two-pack curable composition set, thermally conductive cured produc...

Method for manufacturing multilayer wiring board

Method for manufacturing multilayer wiring board

Multichip module and electronic device

Semiconductor device

Multichip module including surface mounting part embedded therein

Aerospace vehicle system

Power module and air conditioner

Solid laser amplification device

Bonded semiconductor wafer and method for manufacturing bonded semi...

Solid laser amplification device

Heat treatment method

Method of producing bonded wafer

Power semiconductor device

Power semiconductor device

Power semiconductor device

Power semiconductor device

Semiconductor module and boost rectifier circuit

Method for manufacturing a bonded SOI wafer

Method for manufacturing SOI wafer

Silicon epitaxial wafer, method for manufacturing the same, bonded...

Compton camera

Method for producing bonded wafer

Semiconductor module

Method of recommending information, system thereof, and server

Video content viewing apparatus

Infrared detector, infrared detecting apparatus, and method of manu...

Method for user interface, display device, and user interface system

Patents Applicationslast 30 patents

POLYMER LATEX COMPOSITION, IMMERSION MOLDED BODY, AND METHOD FOR PR...

BLOOD COLLECTION SYSTEM AND BLOOD COLLECTION METHOD

CHLOROPRENE-BASED POLYMER LATEX COMPOSITION, AND DIP-MOLDED ARTICLE

CHLOROPRENE POLYMER AND MANUFACTURING METHOD THEREFOR, CHLOROPRENE...

CHLOROPRENE POLYMER LATEX COMPOSITION, AND DIP MOLDED BODY

CHLOROPRENE POLYMER LATEX AND MANUFACTURING METHOD THEREFOR, AND DI...

CHLOROPRENE POLYMER COMPOSITION, DIP-MOLDED ARTICLE, AND METHOD FOR...

CHLOROPRENE POLYMER COMPOSITION, MANUFACTURING METHOD THEREFOR, AND...

CONTACTLESS BIOMETRIC AUTHENTICATION DEVICE, CONTACTLESS BIOMETRIC...

PHOTOGRAPHING APPARATUS AND AUTHENTICATION APPARATUS

TWO-AGENT CURABLE HEAT CONDUCTIVE GREASE COMPOSITION, HEAT CONDUCTI...

TWO-PACK CURABLE COMPOSITION SET, THERMALLY CONDUCTIVE CURED PRODUC...

OBSERVATION CONTROL DEVICE AND SPACECRAFT, OBSERVATION CONTROL METH...

INFORMATION PROCESSING SYSTEM AND SEARCH METHOD

ELECTRIC MOTOR AND VENTILATING FAN

MULTICHIP MODULE, ELECTRONIC DEVICE AND MANUFACTURING METHOD OF MUL...

SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD

METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD

SOLID LASER AMPLIFICATION DEVICE

SOLID LASER AMPLIFICATION DEVICE

BONDING METHOD AND BONDED BODY

BONDED SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURING BONDED SEMI...

MULTICHIP MODULE, ON BOARD COMPUTER, SENSOR INTERFACE SUBSTRATE, AN...

POWER MODULE AND AIR CONDITIONER

HEAT TREATMENT METHOD

METHOD OF PRODUCING BONDED WAFER

METHOD FOR MANUFACTURING A BONDED SOI WAFER

SEMICONDUCTOR MODULE AND BOOST RECTIFIER CIRCUIT

POWER MODULE AND AIR CONDITIONER