Masahiro Koike

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Kanagawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having heat spreader with center opening
- Patent number 8,058,736
- Issue date Nov 15, 2011
- Renesas Electronics Corporation
- Masahiro Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin molded semiconductor device and mold
- Patent number 7,448,861
- Issue date Nov 11, 2008
- NEC Electronics Corporation
- Masahiro Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin molded semiconductor device
- Patent number 7,265,444
- Issue date Sep 4, 2007
- NEC Electronics Corporation
- Masahiro Koike
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device and apparatus and method for manufacturing the...
- Publication number 20070296076
- Publication date Dec 27, 2007
- NEC ELECTRONICS CORPORATION
- Masahiro Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin molded semiconductor device and mold
- Publication number 20060071321
- Publication date Apr 6, 2006
- NEC Electronics Corporation
- Masahiro Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin molded semiconductor device and mold
- Publication number 20040262741
- Publication date Dec 30, 2004
- NEC ELECTRONICS CORPORATION
- Masahiro Koike
- H01 - BASIC ELECTRIC ELEMENTS