TREA

Masahiro Koizumi

Follow

Person

  • Hitachi, JP
People

Patents Grantslast 30 patents

  • Information Patent Grant

    Mosfet package
    • Patent number 8,816,411
    • Issue date Aug 26, 2014
    • Renesas Electronics Corporation
    • Ryoichi Kajiwara
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Mosfet package
    • Patent number 8,455,986
    • Issue date Jun 4, 2013
    • Renesas Electronics Corporation
    • Ryoichi Kajiwara
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Semiconductor device
    • Patent number 8,183,607
    • Issue date May 22, 2012
    • Renesas Electronics Corporation
    • Ryoichi Kajiwara
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    MOSFET package
    • Patent number 7,985,991
    • Issue date Jul 26, 2011
    • Renesas Electronics Corporation
    • Ryoichi Kajiwara
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    MOSFET package
    • Patent number 7,400,002
    • Issue date Jul 15, 2008
    • Renesas Technology Corp.
    • Ryoichi Kajiwara
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    MOSFET package
    • Patent number 7,394,146
    • Issue date Jul 1, 2008
    • Renesas Tehcnology Corp.
    • Ryoichi Kajiwara
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    MOSFET package
    • Patent number 7,342,267
    • Issue date Mar 11, 2008
    • Renesas Technology Corp.
    • Ryoichi Kajiwara
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    MOSFET package
    • Patent number 7,332,757
    • Issue date Feb 19, 2008
    • Renesas Technology Corp.
    • Ryoichi Kajiwara
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Circuit board
    • Patent number 7,141,741
    • Issue date Nov 28, 2006
    • Hitachi, Ltd.
    • Kazuji Yamada
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Grant

    Flip chip assembly structure for semiconductor device and method of...
    • Patent number 6,798,072
    • Issue date Sep 28, 2004
    • Hitachi, Ltd.
    • Ryoichi Kajiwara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device and manufacturing method thereof
    • Patent number 6,784,554
    • Issue date Aug 31, 2004
    • Hitachi, Ltd.
    • Ryoichi Kajiwara
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Semiconductor device
    • Patent number 6,774,466
    • Issue date Aug 10, 2004
    • Renesas Technology Corp.
    • Ryoichi Kajiwara
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method of manufacturing a semiconductor package by attaching a lead...
    • Patent number 6,569,764
    • Issue date May 27, 2003
    • Hitachi, Ltd.
    • Toshinori Hirashima
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device
    • Patent number 6,434,008
    • Issue date Aug 13, 2002
    • Hitachi, Ltd.
    • Kazuji Yamada
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Grant

    Semiconductor device having power semiconductor elements
    • Patent number 5,956,231
    • Issue date Sep 21, 1999
    • Hitachi, Ltd.
    • Kazuji Yamada
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Grant

    Ultrasonic bonding method and ultrasonic bonding apparatus
    • Patent number 5,884,835
    • Issue date Mar 23, 1999
    • Hitachi, Ltd.
    • Ryoichi Kajiwara
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Semiconductor device using annealed bonding wire
    • Patent number 5,153,704
    • Issue date Oct 6, 1992
    • Hitachi, Ltd.
    • Jin Onuki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Semiconductor device and production process thereof, as well as wir...
    • Patent number 4,976,393
    • Issue date Dec 11, 1990
    • Hitachi, Ltd.
    • Makoto Nakajima
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Semiconductor device
    • Patent number 4,965,656
    • Issue date Oct 23, 1990
    • Hitachi, Ltd.
    • Yasushi Koubuchi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Corrosion-resistant aluminum electronic material
    • Patent number 4,912,544
    • Issue date Mar 27, 1990
    • Hitachi, Ltd.
    • Jin Onuki
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20130264696
    • Publication date Oct 10, 2013
    • Ryoichi Kajiwara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20120217556
    • Publication date Aug 30, 2012
    • Ryoichi Kajiwara
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20110298020
    • Publication date Dec 8, 2011
    • Ryoichi Kajiwara
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20080169537
    • Publication date Jul 17, 2008
    • Ryoichi Kajiwara
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Semiconductor device
    • Publication number 20070040249
    • Publication date Feb 22, 2007
    • Ryoichi Kajiwara
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Semiconductor device
    • Publication number 20070040250
    • Publication date Feb 22, 2007
    • Ryoichi Kajiwara
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Semiconductor device
    • Publication number 20070040248
    • Publication date Feb 22, 2007
    • Ryoichi Kajiwara
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Semiconductor device
    • Publication number 20070029540
    • Publication date Feb 8, 2007
    • Ryoichi Kajiwara
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Semiconductor device
    • Publication number 20060197196
    • Publication date Sep 7, 2006
    • Ryoichi Kajiwara
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Semiconductor device
    • Publication number 20060197200
    • Publication date Sep 7, 2006
    • Ryoichi Kajiwara
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Semiconductor device
    • Publication number 20040217474
    • Publication date Nov 4, 2004
    • Ryoichi Kajiwara
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Semiconductor device
    • Publication number 20040150082
    • Publication date Aug 5, 2004
    • Ryoichi Kajiwara
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Circuit board
    • Publication number 20040056349
    • Publication date Mar 25, 2004
    • Kazuji Yamada
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor device and manufacturing method thereof
    • Publication number 20030127747
    • Publication date Jul 10, 2003
    • Ryoichi Kajiwara
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Semiconductor device
    • Publication number 20030016502
    • Publication date Jan 23, 2003
    • Kazuji Yamada
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor package and flip chip bonding method therein
    • Publication number 20030001286
    • Publication date Jan 2, 2003
    • Ryoichi Kajiwara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Flip chip assembly structure for semiconductor device and method of...
    • Publication number 20020056906
    • Publication date May 16, 2002
    • Ryoichi Kajiwara
    • H01 - BASIC ELECTRIC ELEMENTS