Masahiro Kyozuka

Person

Nagano-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring board
- Patent number 12,082,346
- Issue date Sep 3, 2024
- Shinko Electric Industries Co., Ltd.
- Masahiro Kyozuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 11,171,080
- Issue date Nov 9, 2021
- Shinko Electric Industries Co., Ltd.
- Takahiko Kiso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component device and method for manufacturing the same
- Patent number 10,383,228
- Issue date Aug 13, 2019
- Shinko Electric Industries Co., Ltd.
- Masahiro Kyozuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component device and method for manufacturing the same
- Patent number 10,098,228
- Issue date Oct 9, 2018
- Shinko Electric Industries Co., Ltd.
- Masahiro Kyozuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component device
- Patent number 9,941,232
- Issue date Apr 10, 2018
- Shinko Electric Industries Co., Ltd.
- Satoshi Shiraki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method therefor
- Patent number 9,299,678
- Issue date Mar 29, 2016
- Shinko Electric Industries Co., Ltd.
- Masahiro Kyozuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method for manufacturing semiconductor pa...
- Patent number 9,142,524
- Issue date Sep 22, 2015
- Shinko Electric Industries Co., Ltd.
- Masahiro Kyozuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method
- Patent number 8,941,230
- Issue date Jan 27, 2015
- Shinko Electric Industries Co., Ltd.
- Masahiro Kyozuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and method of manufacturing the same, and semiconducto...
- Patent number 8,901,725
- Issue date Dec 2, 2014
- Shinko Electric Industries Co., Ltd.
- Akihiko Tateiwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electric part package and manufacturing method thereof
- Patent number 8,692,363
- Issue date Apr 8, 2014
- Shinko Electric Industries Co., Ltd.
- Naoyuki Koizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a wiring substrate
- Patent number 7,597,929
- Issue date Oct 6, 2009
- Shinko Electric Industries Co., Ltd.
- Masahiro Kyozuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming active device on substrate that includes embossin...
- Patent number 7,329,568
- Issue date Feb 12, 2008
- Shinko Electric Industries Co., Ltd.
- Masahiro Kyozuka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD
- Publication number 20230300987
- Publication date Sep 21, 2023
- Shinko Electric Industries Co., Ltd.
- Masahiro Kyozuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20200126897
- Publication date Apr 23, 2020
- Shinko Electric Industries Co., Ltd.
- Takahiko Kiso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190029113
- Publication date Jan 24, 2019
- Shinko Electric Industries Co., Ltd.
- Masahiro Kyozuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND SEMICONDUCTOR PACKAGE
- Publication number 20190013263
- Publication date Jan 10, 2019
- Shinko Electric Industries Co., Ltd.
- Masahiro KYOZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT DEVICE
- Publication number 20170062370
- Publication date Mar 2, 2017
- Shinko Electric Industries Co., Ltd.
- Satoshi Shiraki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160057863
- Publication date Feb 25, 2016
- Shinko Electric Industries Co., Ltd.
- Masahiro Kyozuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD
- Publication number 20140070396
- Publication date Mar 13, 2014
- Shinko Electric Industries Co., Ltd.
- Masahiro Kyozuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PA...
- Publication number 20120187557
- Publication date Jul 26, 2012
- Shinko Electric Industries Co., Ltd.
- Masahiro KYOZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR
- Publication number 20120153509
- Publication date Jun 21, 2012
- Shinko Electric Industries Co., Ltd.
- Masahiro Kyozuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRIC PART PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20120119379
- Publication date May 17, 2012
- Shinko Electric Industries Co., Ltd.
- Naoyuki KOIZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTO...
- Publication number 20110227214
- Publication date Sep 22, 2011
- Shinko Electric Industries Co., Ltd.
- Akihiko Tateiwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing a wiring substrate
- Publication number 20070190237
- Publication date Aug 16, 2007
- Shinko Electric Industries Co., Ltd.
- Masahiro Kyozuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substrate, semiconductor device, substrate fabricating method, and...
- Publication number 20060043570
- Publication date Mar 2, 2006
- Shigetsugu Muramatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of forming active device on substrate and the substrate
- Publication number 20050275020
- Publication date Dec 15, 2005
- Shinko Electric Industries Co., Ltd.
- Masahiro Kyozuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate treating apparatus and method
- Publication number 20050161157
- Publication date Jul 28, 2005
- Shinko Electric Industries Co., Ltd.
- Shigetsugu Muramatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE HAVING EXTERNAL CONNECTING TERMINALS AND PROCE...
- Publication number 20030107131
- Publication date Jun 12, 2003
- Shinko Electric Industries Co. Ltd
- MITSUTOSHI HIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having external connecting terminals and proce...
- Publication number 20010028108
- Publication date Oct 11, 2001
- Shinko Electric Industries Co., Ltd.
- Mitsutoshi Higashi
- H01 - BASIC ELECTRIC ELEMENTS

Masahiro Kyozuka

Person

Patents Grantslast 30 patents

Wiring board

Wiring substrate

Electronic component device and method for manufacturing the same

Electronic component device and method for manufacturing the same

Electronic component device

Semiconductor package and manufacturing method therefor

Semiconductor package and method for manufacturing semiconductor pa...

Semiconductor package and manufacturing method

Wiring board and method of manufacturing the same, and semiconducto...

Electric part package and manufacturing method thereof

Method of manufacturing a wiring substrate

Method of forming active device on substrate that includes embossin...

Patents Applicationslast 30 patents

WIRING BOARD

WIRING SUBSTRATE

ELECTRONIC COMPONENT DEVICE AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD AND SEMICONDUCTOR PACKAGE

ELECTRONIC COMPONENT DEVICE

ELECTRONIC COMPONENT DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PA...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR

ELECTRIC PART PACKAGE AND MANUFACTURING METHOD THEREOF

WIRING BOARD AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTO...

Method of manufacturing a wiring substrate

Substrate, semiconductor device, substrate fabricating method, and...

Method of forming active device on substrate and the substrate

Substrate treating apparatus and method

SEMICONDUCTOR DEVICE HAVING EXTERNAL CONNECTING TERMINALS AND PROCE...

Semiconductor device having external connecting terminals and proce...