TREA

Masahiro Lee

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  • Tokai-City, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Silicon interposer systems
    • Patent number 9,093,396
    • Issue date Jul 28, 2015
    • Masahiro Lee
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Ultrathin wafer transport systems
    • Patent number 8,905,680
    • Issue date Dec 9, 2014
    • Masahiro Lee
    • B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
  • Information Patent Grant

    Ultrathin wafer debonding systems
    • Patent number 8,858,756
    • Issue date Oct 14, 2014
    • Masahiro Lee
    • B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

  • Information Patent Application

    Ultrathin Wafer Transport Systems
    • Publication number 20130108378
    • Publication date May 2, 2013
    • Masahiro Lee
    • B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
  • Information Patent Application

    Ultrathin Wafer Debonding Systems
    • Publication number 20130105090
    • Publication date May 2, 2013
    • Masahiro Lee
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    Silicon Interposer Systems
    • Publication number 20130107479
    • Publication date May 2, 2013
    • Masahiro Lee
    • H01 - BASIC ELECTRIC ELEMENTS