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Masahiro OKAMOTO
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SAkita-shi, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Component-incorporated substrate and method for manufacturing same
Patent number
11,871,524
Issue date
Jan 9, 2024
Fujikura Ltd.
Masahiro Okamoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Component-embedded board and method of manufacturing same
Patent number
10,383,231
Issue date
Aug 13, 2019
Fujikura Ltd.
Yoshinori Sano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-layer wiring board
Patent number
9,699,921
Issue date
Jul 4, 2017
Fujikura Ltd.
Masahiro Okamoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Component built-in board and method of manufacturing the same, and...
Patent number
9,591,767
Issue date
Mar 7, 2017
Fujikura Ltd.
Kazuhisa Itoi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Component built-in board and method of manufacturing the same
Patent number
9,282,628
Issue date
Mar 8, 2016
Fujikura Ltd.
Masahiro Okamoto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Laminated wiring board and manufacturing method for same
Patent number
8,941,016
Issue date
Jan 27, 2015
Fujikura Ltd.
Masahiro Okamoto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multi-layer board manufacturing method thereof
Patent number
8,726,495
Issue date
May 20, 2014
Fujikura Ltd.
Osamu Nakao
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Process for producing multilayer printed wiring board
Patent number
7,886,438
Issue date
Feb 15, 2011
Fujikura Ltd.
Shoji Ito
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of manufacturing a printed wiring board
Patent number
7,849,591
Issue date
Dec 14, 2010
Fujikura Ltd.
Masahiro Okamoto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multilayer board manufacturing method
Patent number
7,421,779
Issue date
Sep 9, 2008
Fujikura Ltd.
Osamu Nakao
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multilayer wiring board, base for multilayer wiring board, printed...
Patent number
7,312,400
Issue date
Dec 25, 2007
Fujikura Ltd.
Shoji Ito
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
COMPONENT-INCORPORATED SUBSTRATE AND METHOD FOR MANUFACTURING SAME
Publication number
20240090140
Publication date
Mar 14, 2024
FUJIKURA LTD.
Masahiro Okamoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPONENT-INCORPORATED SUBSTRATE AND METHOD FOR MANUFACTURING SAME
Publication number
20210204414
Publication date
Jul 1, 2021
FUJIKURA LTD.
Masahiro Okamoto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MULTI-LAYER WIRING BOARD
Publication number
20160037630
Publication date
Feb 4, 2016
FUJIKURA LTD.
Masahiro Okamoto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
COMPONENT-EMBEDDED BOARD AND METHOD OF MANUFACTURING SAME
Publication number
20150359103
Publication date
Dec 10, 2015
FUJIKURA LTD.
Yoshinori SANO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME, AND...
Publication number
20140268574
Publication date
Sep 18, 2014
FUJIKURA LTD.
Kazuhisa Itoi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME
Publication number
20140202741
Publication date
Jul 24, 2014
FUJIKURA LTD.
Masahiro Okamoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LAMINATED WIRING BOARD AND MANUFACTURING METHOD FOR SAME
Publication number
20130118791
Publication date
May 16, 2013
FUJIKURA LTD.
Masahiro OKAMOTO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PROCESS FOR PRODUCING MULTILAYER PRINTED WIRING BOARD
Publication number
20090217522
Publication date
Sep 3, 2009
FUJIKURA LTD.
Shoji ITO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
Publication number
20090154132
Publication date
Jun 18, 2009
FUJIKURA LTD.
Masahiro Okamoto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MULTI-LAYER BOARD MANUFACTURING METHOD THEREOF
Publication number
20080250634
Publication date
Oct 16, 2008
FUJIKURA LTD.
Osamu NAKAO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Multilayer board and its manufacturing method
Publication number
20060191133
Publication date
Aug 31, 2006
Osamu Nakao
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Multilayer printed wiring board and process for producing the same
Publication number
20060180344
Publication date
Aug 17, 2006
Shoji Ito
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Multilayer wiring board, base for multilayer wiring board, printed...
Publication number
20050155792
Publication date
Jul 21, 2005
FUJIKURA LTD.
Shoji Ito
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR