Masahiro Sakai

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Koshoku, JP

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Patents Grantslast 30 patents

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Method for manufacturing bonded wafer and bonded wafer manufactured...
- Patent number 6,004,866
- Issue date Dec 21, 1999
- Shin-Etsu Handotai, Co., Ltd.
- Masatake Nakano
- H01 - BASIC ELECTRIC ELEMENTS