Masahiro Sakamoto

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Kariya-city, JP

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Patents Grantslast 30 patents

Information Patent Grant
Bonding structure and bonding method of heat diffusion member, and...
- Patent number 8,772,925
- Issue date Jul 8, 2014
- Denso Corporation
- Koji Noda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING STRUCTURE AND BONDING METHOD OF HEAT DIFFUSION MEMBER, AND...
- Publication number 20120152510
- Publication date Jun 21, 2012
- NIPPON SOKEN, INC.
- Koji Noda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR