Masahiro Suzuki

Person

Hitachi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Adhesive film of quinoline polymer and bismaleimide
- Patent number 6,462,148
- Issue date Oct 8, 2002
- Hitachi Chemical Co., Ltd.
- Masahiro Suzuki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thin-film multilayer wiring board with wiring and via holes in a th...
- Patent number 6,326,561
- Issue date Dec 4, 2001
- Hitachi, Ltd.
- Ryuji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film multilayer wiring board and production thereof
- Patent number 6,190,493
- Issue date Feb 20, 2001
- Hitachi, Ltd.
- Ryuji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring substrate and method for production thereof
- Patent number 6,132,852
- Issue date Oct 17, 2000
- Hitachi, Ltd.
- Masahiro Suzuki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of manufacturing a crosslinking formed body
- Patent number 5,948,865
- Issue date Sep 7, 1999
- Hitachi Cable, Ltd.
- Yukio Shimazaki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thin film wiring board
- Patent number 5,686,191
- Issue date Nov 11, 1997
- Hitachi, Ltd.
- Takao Miwa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polymerizable compouund, process for producing same and setting com...
- Patent number 5,565,536
- Issue date Oct 15, 1996
- Hitachi, Ltd.
- Shin Nishimura
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
LSI package board
- Patent number 5,565,706
- Issue date Oct 15, 1996
- Hitachi, Ltd.
- Osamu Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymerizable compound, process for producing same and setting comp...
- Patent number 5,410,069
- Issue date Apr 25, 1995
- Hitachi, Ltd.
- Shin Nishimura
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Multilayer printed circuit board and production thereof
- Patent number 5,352,762
- Issue date Oct 4, 1994
- Hitachi, Ltd.
- Akira Nagai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer circuit board, method of manufacturing the same and app...
- Patent number 5,065,285
- Issue date Nov 12, 1991
- Hitachi, Ltd.
- Akira Nagai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermosetting resin composition, printed circuit board using the re...
- Patent number 5,045,381
- Issue date Sep 3, 1991
- Hitachi, Ltd.
- Masao Suzuki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Circuit board and process for producing the same
- Patent number 5,021,296
- Issue date Jun 4, 1991
- Hitachi, Ltd.
- Yoshihiro Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Article having hard film, a flexible body and a fiber layer dispose...
- Patent number 4,469,729
- Issue date Sep 4, 1984
- Hitachi Cable Ltd.
- Shigetaka Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITION AND ADHESIVE FILM
- Publication number 20020151659
- Publication date Oct 17, 2002
- MASAHIRO SUZUKI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Masahiro Suzuki

Person

Patents Grantslast 30 patents

Adhesive film of quinoline polymer and bismaleimide

Thin-film multilayer wiring board with wiring and via holes in a th...

Thin-film multilayer wiring board and production thereof

Multilayer wiring substrate and method for production thereof

Method of manufacturing a crosslinking formed body

Thin film wiring board

Polymerizable compouund, process for producing same and setting com...

LSI package board

Polymerizable compound, process for producing same and setting comp...

Multilayer printed circuit board and production thereof

Multi-layer circuit board, method of manufacturing the same and app...

Thermosetting resin composition, printed circuit board using the re...

Circuit board and process for producing the same

Article having hard film, a flexible body and a fiber layer dispose...

Patents Applicationslast 30 patents

RESIN COMPOSITION AND ADHESIVE FILM