Masahiro Tadauchi

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Thermosetting flux and solder paste
- Patent number 7,604,154
- Issue date Oct 20, 2009
- Kabushiki Kaisha Toshiba
- Kazutaka Matsumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting material, semiconductor device and method of manufacturing...
- Patent number 6,949,814
- Issue date Sep 27, 2005
- Kabushiki Kaisha Toshiba
- Cao Minh Thai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder material, device using the same and manufacturing process th...
- Patent number 6,673,310
- Issue date Jan 6, 2004
- Kabushiki Kaisha Toshiba
- Masahiro Tadauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering method and soldering apparatus
- Patent number 6,464,122
- Issue date Oct 15, 2002
- Kuroda Techno Co., Ltd.
- Masahiro Tadauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder material and method of manufacturing solder material
- Patent number 6,386,426
- Issue date May 14, 2002
- Kabushiki Kaisha Toshiba
- Masahiro Tadauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of joining metallic members, and joined metallic members
- Patent number 6,220,501
- Issue date Apr 24, 2001
- Kabushiki Kaisha Toshiba
- Masahiro Tadauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder material and method of manufacturing solder material
- Patent number 6,186,390
- Issue date Feb 13, 2001
- Kabushiki Kaisha Toshiba
- Masahiro Tadauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for pyrolytically decomposing waste plastic
- Patent number 6,172,275
- Issue date Jan 9, 2001
- Kabushiki Kaisha Toshiba
- Masahiro Tadauchi
- C10 - PETROLEUM, GAS OR COKE INDUSTRIES TECHNICAL GASES CONTAINING CARBON MON...
Information Patent Grant
Soldering method and soldering apparatus
- Patent number 6,123,248
- Issue date Sep 26, 2000
- Kabushiki Kaisha Toshiba
- Masahiro Tadauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for pyrolytically decomposing waste plastic
- Patent number 5,608,136
- Issue date Mar 4, 1997
- Kabushiki Kaisha Toshiba
- Yukishige Maezawa
- C10 - PETROLEUM, GAS OR COKE INDUSTRIES TECHNICAL GASES CONTAINING CARBON MON...

Patents Applicationslast 30 patents

Information Patent Application
THERMOSETTING FLUX AND SOLDER PASTE
- Publication number 20070221712
- Publication date Sep 27, 2007
- Kabushiki Kaisha Toshiba
- Kazutaka Matsumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Soldered material, semiconductor device, method of soldering, and m...
- Publication number 20060081995
- Publication date Apr 20, 2006
- Kabushiki Kaisha Toshiba
- Toshihide Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead free solder
- Publication number 20060067853
- Publication date Mar 30, 2006
- Kabushiki Kaisha Toshiba
- Toshihide Takahashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Soldered material, semiconductor device, method of soldering, and m...
- Publication number 20050218525
- Publication date Oct 6, 2005
- Kabushiki Kaisha Toshiba
- Toshihide Takahashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermosetting flux and solder paste
- Publication number 20050056687
- Publication date Mar 17, 2005
- Kabushiki Kaisha Toshiba
- Kazutaka Matsumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead-free joining material and joining method using the same
- Publication number 20040096688
- Publication date May 20, 2004
- Kabushiki Kaisha Toshiba
- Masahiro Tadauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mounting material, semiconductor device and method of manufacturing...
- Publication number 20030111728
- Publication date Jun 19, 2003
- Cao Minh Thai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder material, device using the same and manufacturing process th...
- Publication number 20010029095
- Publication date Oct 11, 2001
- Masahiro Tadauchi
- H01 - BASIC ELECTRIC ELEMENTS

Masahiro Tadauchi

Person

Patents Grantslast 30 patents

Thermosetting flux and solder paste

Mounting material, semiconductor device and method of manufacturing...

Solder material, device using the same and manufacturing process th...

Soldering method and soldering apparatus

Solder material and method of manufacturing solder material

Method of joining metallic members, and joined metallic members

Solder material and method of manufacturing solder material

Method and apparatus for pyrolytically decomposing waste plastic

Soldering method and soldering apparatus

Method and apparatus for pyrolytically decomposing waste plastic

Patents Applicationslast 30 patents

THERMOSETTING FLUX AND SOLDER PASTE

Soldered material, semiconductor device, method of soldering, and m...

Lead free solder

Soldered material, semiconductor device, method of soldering, and m...

Thermosetting flux and solder paste

Lead-free joining material and joining method using the same

Mounting material, semiconductor device and method of manufacturing...

Solder material, device using the same and manufacturing process th...