Masahiro Tsuji

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Kyoto, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and process for manufacturing the same
- Patent number 6,404,066
- Issue date Jun 11, 2002
- Rohm Co., Ltd.
- Masahiro Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging material for electronic components
- Patent number 5,698,904
- Issue date Dec 16, 1997
- Rohm Co., Ltd.
- Masahiro Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of encapsulating semiconductor devices using a lead frame wi...
- Patent number 5,672,550
- Issue date Sep 30, 1997
- Rohm Co., Ltd.
- Masahiro Tsuji
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device having a multilayer interconnection structure
- Patent number 5,530,282
- Issue date Jun 25, 1996
- Rohm Co., Ltd.
- Masahiro Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing lead frame used in electronic component
- Patent number 5,286,342
- Issue date Feb 15, 1994
- Rohm Co., Ltd.
- Masahiro Tsuji
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20070120236
- Publication date May 31, 2007
- Rohm Co. Ltd.
- Kenji Otani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20070063334
- Publication date Mar 22, 2007
- Rohm Co. Ltd.
- Kenji Otani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20050212148
- Publication date Sep 29, 2005
- ROHM CO., LTD.
- Kenji Otani
- H01 - BASIC ELECTRIC ELEMENTS