Masahiro Tsuji

Person

Urawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing film carrier
- Patent number 5,004,520
- Issue date Apr 2, 1991
- Nippon Mining Co., Ltd
- Masahiro Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film carrier and method of manufacturing same
- Patent number 4,908,275
- Issue date Mar 13, 1990
- Nippon Mining Co., Ltd
- Masahiro Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-strength, high-conductivity copper alloy
- Patent number 4,666,667
- Issue date May 19, 1987
- Nippon Mining Co., Ltd
- Morinori Kamio
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Al-killed cold-rolled steel sheet with excellent demagnetization ch...
- Patent number 4,609,412
- Issue date Sep 2, 1986
- Nippon Mining Co., Ltd
- Morinori Kamio
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper alloy for radiators
- Patent number 4,452,757
- Issue date Jun 5, 1984
- Nihon Kogyo Kabushiki Kaisha
- Susumu Kawauchi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper alloy for use as lead material for semiconductor devices
- Patent number 4,366,117
- Issue date Dec 28, 1982
- Nikon Kogyo Kabushiki Kaisha
- Masahiro Tsuji
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
High-strength-conductivity copper alloy
- Patent number 4,362,579
- Issue date Dec 7, 1982
- Nihon Kogyo Kabushiki Kaisha
- Masahiro Tsuji
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Masahiro Tsuji

Person

Patents Grantslast 30 patents

Method of manufacturing film carrier

Film carrier and method of manufacturing same

High-strength, high-conductivity copper alloy

Al-killed cold-rolled steel sheet with excellent demagnetization ch...

Copper alloy for radiators

Copper alloy for use as lead material for semiconductor devices

High-strength-conductivity copper alloy