Masahiro Wada

Person

Ohmiya, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Suction holder and holding mechanism for ring frame
- Patent number 11,538,712
- Issue date Dec 27, 2022
- Disco Corporation
- Masahiro Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ring frame holding mechanism
- Patent number 11,318,625
- Issue date May 3, 2022
- Disco Corporation
- Masahiro Wada
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Tape affixing apparatus
- Patent number 10,943,811
- Issue date Mar 9, 2021
- Disco Corporation
- Masahiro Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition for encapsulating semiconductor and semiconductor...
- Patent number 8,883,883
- Issue date Nov 11, 2014
- Sumitomo Bakelite Co., Ltd.
- Masahiro Wada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Silicon-containing curable composition, cured product of the silico...
- Patent number 8,809,478
- Issue date Aug 19, 2014
- Adeka Corporation
- Masako Saito
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for producing porous body
- Patent number 8,747,710
- Issue date Jun 10, 2014
- Mitsubishi Materials Corporation
- Tetsuji Tsujimoto
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Resin composition for encapsulating semiconductor and semiconductor...
- Patent number 8,653,205
- Issue date Feb 18, 2014
- Sumitomo Bakelite Co., Ltd.
- Masahiro Wada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor device
- Patent number 8,629,556
- Issue date Jan 14, 2014
- Sumitomo Bakelite Co., Ltd.
- Mitsuo Sugino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, core layer material, buildup layer material,...
- Patent number 8,592,994
- Issue date Nov 26, 2013
- Sumitomo Bakelite Co., Ltd.
- Kenya Tachibana
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition for encapsulating semiconductor and semiconductor...
- Patent number 8,552,572
- Issue date Oct 8, 2013
- Sumitomo Bakelite Co., Ltd.
- Masahiro Wada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin composition for encapsulating semiconductor and semiconductor...
- Patent number 8,502,399
- Issue date Aug 6, 2013
- Sumitomo Bakelite Co., Ltd.
- Masahiro Wada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Apparatus for producing porous body and method for producing porous...
- Patent number 8,303,284
- Issue date Nov 6, 2012
- Mitsubishi Materials Corporation
- Tetsuji Tsujimoto
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor device
- Patent number 8,008,767
- Issue date Aug 30, 2011
- Sumitomo Bakelight Co., Ltd.
- Masahiro Wada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting structure for flip-chip semiconductor package, build-up...
- Patent number 7,893,542
- Issue date Feb 22, 2011
- Sumitomo Bakelite Company, Ltd.
- Kenya Tachibana
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite porous body, gas diffusion layer member, cell member, and...
- Patent number 7,838,172
- Issue date Nov 23, 2010
- Mitsubishi Materials Corporation
- Masahiro Wada
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Porous titanium having low contact resistance
- Patent number 7,794,853
- Issue date Sep 14, 2010
- Mitsubishi Materials Corporation
- Kenji Orito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Spongy sintered article of titanium or titanium alloy exhibiting ex...
- Patent number 7,771,506
- Issue date Aug 10, 2010
- Mitsubishi Materials Corporation
- Masahiro Wada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Board building material, board building material producing method,...
- Patent number 7,661,511
- Issue date Feb 16, 2010
- Yoshino Gypsum Co., Ltd.
- Tomoya Hasegawa
- E04 - BUILDING
Information Patent Grant
High strength spongy sintered metal composite sheet and production...
- Patent number 6,423,422
- Issue date Jul 23, 2002
- Mitsubishi Materials Corporation
- Masahiro Wada
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Hydrogen occluding alloy
- Patent number 6,083,327
- Issue date Jul 4, 2000
- Mitsubishi Materials Corporation
- Kouichi Kita
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Hydrogen occluding alloy
- Patent number 5,900,334
- Issue date May 4, 1999
- Mitsubishi Materials Corporation
- Masahiro Wada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Bit rate controller for multiplexer of encoded video
- Patent number 5,550,590
- Issue date Aug 27, 1996
- Kokusai Denshin Denwa Kabushiki Kaisha
- Shigeyuki Sakazawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for preventing desensitization and radio interference of rad...
- Patent number 5,390,345
- Issue date Feb 14, 1995
- Nippon Telegraph and Telephone Corporation
- Masahiro Wada
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Moving picture signal transmission system
- Patent number 4,827,339
- Issue date May 2, 1989
- Kokusai Denshin Denwa Co., Ltd.
- Masahiro Wada
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Movement estimation system for video signals using a recursive grad...
- Patent number 4,695,882
- Issue date Sep 22, 1987
- Kokusai Denshin Denwa Co., Ltd.
- Masahiro Wada
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Frame rate conversion system in television signal
- Patent number 4,672,442
- Issue date Jun 9, 1987
- Kokusai Denshin Denwa Co., Ltd.
- Hirohisa Yamaguchi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
GYPSUM-BASED LOAD-BEARING BOARD, LOAD-BEARING WALL STRUCTURE, AND L...
- Publication number 20240200330
- Publication date Jun 20, 2024
- YOSHINO GYPSUM CO., LTD.
- Ushio SUDO
- B32 - LAYERED PRODUCTS
Information Patent Application
INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING METHOD, AN...
- Publication number 20220300554
- Publication date Sep 22, 2022
- SONY GROUP CORPORATION
- Masahiro WADA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING METHOD, AND P...
- Publication number 20220283700
- Publication date Sep 8, 2022
- SONY GROUP CORPORATION
- MASAHIRO WADA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUCTION HOLDER AND HOLDING MECHANISM FOR RING FRAME
- Publication number 20210082735
- Publication date Mar 18, 2021
- Disco Corporation
- Masahiro WADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RING FRAME HOLDING MECHANISM
- Publication number 20200114525
- Publication date Apr 16, 2020
- Disco Corporation
- Masahiro WADA
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
TAPE AFFIXING APPARATUS
- Publication number 20200090976
- Publication date Mar 19, 2020
- Disco Corporation
- Masahiro WADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXED MATERIAL WITH HIGH EXPANSION RATE FOR PRODUCING POROUS METALL...
- Publication number 20180159115
- Publication date Jun 7, 2018
- MITSUBISHI MATERIALS CORPORATION
- Masahiro Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POSITIVE ELECTRODE FOR LITHIUM-ION SECONDARY CELL, AND LITHIUM-ION...
- Publication number 20170256777
- Publication date Sep 7, 2017
- MITSUBISHI MATERIALS CORPORATION
- Jun Akikusa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GYPSUM BOARD HAVING MOLD RESISTANCE
- Publication number 20140335365
- Publication date Nov 13, 2014
- YOSHINO GYPSUM CO., LTD.
- Masahiro Wada
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN COMPOSITION FOR ENCAPSULATION AND ELECTRONIC COMPONENT DEVICE
- Publication number 20130289187
- Publication date Oct 31, 2013
- SUMITOMO BAKELITE COMPANY LIMITED
- Masahiro Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON-CONTAINING CURABLE COMPOSITION, CURED PRODUCT OF THE SILICO...
- Publication number 20130075154
- Publication date Mar 28, 2013
- ADEKA CORPORATION
- Masako Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR PRODUCING POROUS BODY AND METHOD FOR PRODUCING POROUS...
- Publication number 20130015600
- Publication date Jan 17, 2013
- MITSUBISHI MATERIALS CORPORATION
- Tetsuji Tsujimoto
- B22 - CASTING POWDER METALLURGY
Information Patent Application
RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR AND SEMICONDUCTOR...
- Publication number 20120080809
- Publication date Apr 5, 2012
- Masahiro Wada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR AND SEMICONDUCTOR...
- Publication number 20120061861
- Publication date Mar 15, 2012
- Masahiro Wada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR AND SEMICONDUCTOR...
- Publication number 20120001350
- Publication date Jan 5, 2012
- Masahiro Wada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR AND SEMICONDUCTOR...
- Publication number 20110124775
- Publication date May 26, 2011
- SUMITOMO BAKELITE CO., LTD.
- Masahiro Wada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
APPARATUS FOR PRODUCING POROUS BODY AND METHOD FOR PRODUCING POROUS...
- Publication number 20100289167
- Publication date Nov 18, 2010
- MITSUBISHI MATERIALS CORPORATION
- Tetsuji Tsujimoto
- B22 - CASTING POWDER METALLURGY
Information Patent Application
GYPSUM BOARD HAVING MOLD RESISTANCE
- Publication number 20100190017
- Publication date Jul 29, 2010
- YOSHINO GYPSUM CO., LTD
- Masahiro Wada
- B32 - LAYERED PRODUCTS
Information Patent Application
MIXED MATERIAL WITH HIGH EXPANSION RATE FOR PRODUCING POROUS METALL...
- Publication number 20100032616
- Publication date Feb 11, 2010
- MITSUBISHI MATERIALS CORPORATION
- Masahiro Wada
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR PACKAGE, CORE LAYER MATERIAL, BUILDUP LAYER MATERIAL,...
- Publication number 20100032826
- Publication date Feb 11, 2010
- SUMITOMO BAKELITE COMPANY LIMITED
- Kenya Tachibana
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
POROUS TITANIUM HAVING LOW CONTACT RESISTANCE
- Publication number 20100015507
- Publication date Jan 21, 2010
- MITSUBISHI MATERIALS CORPORATION
- Kenji Orito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20090321919
- Publication date Dec 31, 2009
- Mitsuo Sugino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING STRUCTURE FOR FLIP-CHIP SEMICONDUCTOR PACKAGE, BUILD-UP...
- Publication number 20090273073
- Publication date Nov 5, 2009
- Kenya Tachibana
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device
- Publication number 20090267212
- Publication date Oct 29, 2009
- Masahiro Wada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE POROUS METAL BODY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20090162635
- Publication date Jun 25, 2009
- MITSUBISHI MATERIALS CORPORATION
- Masahiro Wada
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
FUEL CELL
- Publication number 20080176125
- Publication date Jul 24, 2008
- MITSUBISHI MATERIALS CORPORATION
- Eiko Kanda
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Spongy Sintered Article of Titanium or Titanium Alloy Exhibiting Ex...
- Publication number 20080090719
- Publication date Apr 17, 2008
- MITSUBISHI MATERIALS CORPORATION
- Masahiro Wada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR PACKAGE, METHOD OF PRODUCTION THEREOF AND ENCAPSULATI...
- Publication number 20080036097
- Publication date Feb 14, 2008
- Teppei Ito
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Board Building Material, Board Building Material Producing Method,...
- Publication number 20070220824
- Publication date Sep 27, 2007
- Tomoya Hasegawa
- E04 - BUILDING
Information Patent Application
Fuel cell and method for fabricating same
- Publication number 20070134531
- Publication date Jun 14, 2007
- Hidekazu Kimura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Masahiro Wada

Person

Patents Grantslast 30 patents

Suction holder and holding mechanism for ring frame

Ring frame holding mechanism

Tape affixing apparatus

Resin composition for encapsulating semiconductor and semiconductor...

Silicon-containing curable composition, cured product of the silico...

Method for producing porous body

Resin composition for encapsulating semiconductor and semiconductor...

Semiconductor device

Semiconductor package, core layer material, buildup layer material,...

Resin composition for encapsulating semiconductor and semiconductor...

Resin composition for encapsulating semiconductor and semiconductor...

Apparatus for producing porous body and method for producing porous...

Semiconductor device

Connecting structure for flip-chip semiconductor package, build-up...

Composite porous body, gas diffusion layer member, cell member, and...

Porous titanium having low contact resistance

Spongy sintered article of titanium or titanium alloy exhibiting ex...

Board building material, board building material producing method,...

High strength spongy sintered metal composite sheet and production...

Hydrogen occluding alloy

Hydrogen occluding alloy

Bit rate controller for multiplexer of encoded video

Method for preventing desensitization and radio interference of rad...

Moving picture signal transmission system

Movement estimation system for video signals using a recursive grad...

Frame rate conversion system in television signal

Patents Applicationslast 30 patents

GYPSUM-BASED LOAD-BEARING BOARD, LOAD-BEARING WALL STRUCTURE, AND L...

INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING METHOD, AN...

INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING METHOD, AND P...

SUCTION HOLDER AND HOLDING MECHANISM FOR RING FRAME

RING FRAME HOLDING MECHANISM

TAPE AFFIXING APPARATUS

MIXED MATERIAL WITH HIGH EXPANSION RATE FOR PRODUCING POROUS METALL...

POSITIVE ELECTRODE FOR LITHIUM-ION SECONDARY CELL, AND LITHIUM-ION...

GYPSUM BOARD HAVING MOLD RESISTANCE

RESIN COMPOSITION FOR ENCAPSULATION AND ELECTRONIC COMPONENT DEVICE

SILICON-CONTAINING CURABLE COMPOSITION, CURED PRODUCT OF THE SILICO...

APPARATUS FOR PRODUCING POROUS BODY AND METHOD FOR PRODUCING POROUS...

RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR AND SEMICONDUCTOR...

RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR AND SEMICONDUCTOR...

RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR AND SEMICONDUCTOR...

RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR AND SEMICONDUCTOR...

APPARATUS FOR PRODUCING POROUS BODY AND METHOD FOR PRODUCING POROUS...

GYPSUM BOARD HAVING MOLD RESISTANCE

MIXED MATERIAL WITH HIGH EXPANSION RATE FOR PRODUCING POROUS METALL...

SEMICONDUCTOR PACKAGE, CORE LAYER MATERIAL, BUILDUP LAYER MATERIAL,...

POROUS TITANIUM HAVING LOW CONTACT RESISTANCE

SEMICONDUCTOR DEVICE

CONNECTING STRUCTURE FOR FLIP-CHIP SEMICONDUCTOR PACKAGE, BUILD-UP...

Semiconductor Device

COMPOSITE POROUS METAL BODY AND METHOD FOR MANUFACTURING THE SAME

FUEL CELL

Spongy Sintered Article of Titanium or Titanium Alloy Exhibiting Ex...

SEMICONDUCTOR PACKAGE, METHOD OF PRODUCTION THEREOF AND ENCAPSULATI...

Board Building Material, Board Building Material Producing Method,...

Fuel cell and method for fabricating same