Masahiro Yoshikawa

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Kawasaki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming solder bumps
- Patent number 6,319,810
- Issue date Nov 20, 2001
- Fujitsu Limited
- Masayuki Ochiai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump-forming method using two plates and electronic device
- Patent number 6,271,110
- Issue date Aug 7, 2001
- Fujitsu Limited
- Ichiro Yamaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating bump forming plate member
- Patent number 6,090,301
- Issue date Jul 18, 2000
- Fujitsu Limited
- Masataka Mizukoshi
- H01 - BASIC ELECTRIC ELEMENTS