Masahiro Yoshizawa

Person

Takasaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Refinish coating system and repairing method for automotive resin g...
- Patent number 9,604,250
- Issue date Mar 28, 2017
- Shin-Etsu Chemical Co., Ltd.
- Motoo Fukushima
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Temporary adhesive composition, and method of producing thin wafer
- Patent number 8,785,585
- Issue date Jul 22, 2014
- Shin-Etsu Chemical Co., Ltd.
- Masahiro Furuya
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Organosilicon compound-curing composition and silicone-base coating...
- Patent number 7,193,026
- Issue date Mar 20, 2007
- Shin-Etsu Chemical Co., Ltd.
- Akinari Itagaki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Coating composition
- Patent number 5,902,847
- Issue date May 11, 1999
- Kansai Paint Co., Ltd.
- Junpei Yanagi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Coating composition
- Patent number 5,814,703
- Issue date Sep 29, 1998
- Shin-Etsu Chemical Co., Ltd.
- Masaaki Yamaya
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
REFINISH COATING SYSTEM AND REPAIRING METHOD FOR AUTOMOTIVE RESIN G...
- Publication number 20150140345
- Publication date May 21, 2015
- KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
- Motoo FUKUSHIMA
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
TEMPORARY ADHESIVE COMPOSITION, AND METHOD OF PRODUCING THIN WAFER
- Publication number 20140261978
- Publication date Sep 18, 2014
- SHIN-ETSU CHEMICAL CO., LTD.
- Masahiro Furuya
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
COATING COMPOSITIONS FOR RESINS
- Publication number 20140162069
- Publication date Jun 12, 2014
- Shin-Etsu Chemical Co., Ltd.
- Motoo FUKUSHIMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
TEMPORARY ADHESIVE COMPOSITION, AND METHOD OF PRODUCING THIN WAFER
- Publication number 20120175045
- Publication date Jul 12, 2012
- SHIN-ETSU CHEMICAL CO., LTD.
- Masahiro Furuya
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Organosilicon compound - curing composition and silicone-base coati...
- Publication number 20040260048
- Publication date Dec 23, 2004
- Akinari Itagaki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Coating composition for the protection of packaging and interconnec...
- Publication number 20040219785
- Publication date Nov 4, 2004
- Shin-Etsu Chemical Co., Ltd.
- Akinari Itagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Coating composition for the protection of packaging and interconnec...
- Publication number 20030130410
- Publication date Jul 10, 2003
- Akinari Itagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Masahiro Yoshizawa

Person

Patents Grantslast 30 patents

Refinish coating system and repairing method for automotive resin g...

Temporary adhesive composition, and method of producing thin wafer

Organosilicon compound-curing composition and silicone-base coating...

Coating composition

Coating composition

Patents Applicationslast 30 patents

REFINISH COATING SYSTEM AND REPAIRING METHOD FOR AUTOMOTIVE RESIN G...

TEMPORARY ADHESIVE COMPOSITION, AND METHOD OF PRODUCING THIN WAFER

COATING COMPOSITIONS FOR RESINS

TEMPORARY ADHESIVE COMPOSITION, AND METHOD OF PRODUCING THIN WAFER

Organosilicon compound - curing composition and silicone-base coati...

Coating composition for the protection of packaging and interconnec...

Coating composition for the protection of packaging and interconnec...