Masahisa OSE

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Chiyoda-ku, Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Laminate, printed wiring board, semiconductor package, and method f...
- Patent number 11,938,688
- Issue date Mar 26, 2024
- Resonac Corporation
- Noriaki Murakami
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
LAMINATE, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD F...
- Publication number 20240173927
- Publication date May 30, 2024
- Resonac Corporation
- Noriaki MURAKAMI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
LAMINATE, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD F...
- Publication number 20220080702
- Publication date Mar 17, 2022
- Showa Denko Materials Co., Ltd.
- Noriaki MURAKAMI
- B32 - LAYERED PRODUCTS