Masahito Ishii

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Saitama, JP

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Patents Grantslast 30 patents

Information Patent Grant
Process for producing a collapsed filled via hole
- Patent number 7,178,233
- Issue date Feb 20, 2007
- Mitsui Mining & Smelting Co., Ltd.
- Toshiyuki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
2-Metal layer TAB tape and both-sided CSP•BGA tape
- Patent number 6,798,048
- Issue date Sep 28, 2004
- Mitsui Mining and Smelting Company, Ltd.
- Akira Ichiryu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting substrate and its production method, and printed wiring bo...
- Patent number 5,019,944
- Issue date May 28, 1991
- Mitsui Mining & Smelting Co., Ltd.
- Masahito Ishii
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Mold for Wiring Substrate Formation and Process for Producing the S...
- Publication number 20090314525
- Publication date Dec 24, 2009
- Mitsui Mining and Smelting Co., Ltd.
- Hitoshi Kajino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for producing a printed wiring board-forming sheet and mult...
- Publication number 20040111882
- Publication date Jun 17, 2004
- Toshiyuki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board,its manufacturing method and csp manufacturin...
- Publication number 20040099441
- Publication date May 27, 2004
- Akira Ichiryu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Two-metal tab tape, double-sided csp tape, bga tape and method for...
- Publication number 20020187334
- Publication date Dec 12, 2002
- Akira Ichiryu
- H01 - BASIC ELECTRIC ELEMENTS