Masahito Saitoh

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Nagano, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for slicing workpiece and workpiece holder
- Patent number 10,350,788
- Issue date Jul 16, 2019
- Shin-Etsu Handotai Co., Ltd.
- Atsuo Uchiyama
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for processing semiconductor wafer and semiconductor wafer
- Patent number 7,332,437
- Issue date Feb 19, 2008
- Shin-Etsu Handotai Co., Ltd.
- Takashi Nihonmatsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR SLICING WORKPIECE AND WORKPIECE HOLDER
- Publication number 20160303765
- Publication date Oct 20, 2016
- Shin-Etsu Handotai Co., Ltd.
- Atsuo UCHIYAMA
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Method for processing semiconductor wafer and semiconductor wafer
- Publication number 20030171075
- Publication date Sep 11, 2003
- Takashi Nihonmatsu
- H01 - BASIC ELECTRIC ELEMENTS