Masahito TANABE

Person

Annaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Cleaning solution for temporary adhesive for substrates, substrate...
- Patent number 12,187,989
- Issue date Jan 7, 2025
- Shin-Etsu Chemical Co., Ltd.
- Michihiro Sugo
- B08 - CLEANING
Information Patent Grant
Detergent composition, substrate cleaning method, and cleaning meth...
- Patent number 12,168,759
- Issue date Dec 17, 2024
- Shin-Etsu Chemical Co., Ltd.
- Masahito Tanabe
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Cleaning solution for temporary adhesive for substrates, substrate...
- Patent number 12,129,455
- Issue date Oct 29, 2024
- Shin-Etsu Chemical Co., Ltd.
- Michihiro Sugo
- B08 - CLEANING
Information Patent Grant
Method for manufacturing laminate and method for manufacturing subs...
- Patent number 11,183,417
- Issue date Nov 23, 2021
- Shin-Etsu Chemical Co., Ltd.
- Masahito Tanabe
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for manufacturing thin substrate
- Patent number 10,950,481
- Issue date Mar 16, 2021
- Shin-Etsu Chemical Co., Ltd.
- Masahito Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temporary adhesive film roll for substrate processing, method for m...
- Patent number 10,796,939
- Issue date Oct 6, 2020
- Shin-Etsu Chemical Co., Ltd.
- Masahito Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing laminate, temporary adhesive material for wafer pr...
- Patent number 10,242,902
- Issue date Mar 26, 2019
- Shin-Etsu Chemical Co., Ltd.
- Michihiro Sugo
- B32 - LAYERED PRODUCTS
Information Patent Grant
Wafer processing laminate, temporary adhesive material for wafer pr...
- Patent number 10,147,632
- Issue date Dec 4, 2018
- Shin-Etsu Chemical Co., Ltd.
- Shohei Tagami
- B32 - LAYERED PRODUCTS
Information Patent Grant
Wafer processing laminate, temporary adhesive material for wafer pr...
- Patent number 10,128,143
- Issue date Nov 13, 2018
- Shin-Etsu Chemical Co., Ltd.
- Masahito Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing temporary bonding arrangement, wafer processing la...
- Patent number 9,941,145
- Issue date Apr 10, 2018
- Shin-Etsu Chemical Co., Ltd.
- Masahito Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing bonding arrangement, wafer laminate, and thin wafe...
- Patent number 9,934,996
- Issue date Apr 3, 2018
- Shin-Etsu Chemical Co., Ltd.
- Michihiro Sugo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temporary adhesion method and method for producing thin wafer
- Patent number 9,884,979
- Issue date Feb 6, 2018
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing laminate, temporary adhesive material for wafer pr...
- Patent number 9,887,118
- Issue date Feb 6, 2018
- Shin-Etsu Chemical Co., Ltd.
- Shohei Tagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer temporary bonding method and thin wafer manufacturing method
- Patent number 9,646,868
- Issue date May 9, 2017
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- B24 - GRINDING POLISHING
Information Patent Grant
Temporary adhesive for wafer processing, member for wafer processin...
- Patent number 9,334,424
- Issue date May 10, 2016
- Shin-Etsu Chemical Co., Ltd.
- Masahito Tanabe
- B32 - LAYERED PRODUCTS
Information Patent Grant
Wafer processing laminate, wafer processing member, temporary adher...
- Patent number 9,263,333
- Issue date Feb 16, 2016
- Shin-Etsu Chemical Co., Ltd.
- Michihiro Sugo
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
TEMPORARY ADHESION METHOD, DEVICE WAFER PROCESSING METHOD, LAMINATE...
- Publication number 20230178412
- Publication date Jun 8, 2023
- Shin-Etsu Chemical Co., Ltd.
- Tamotsu OOWADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY ADHESIVE MATERIAL FOR SUBSTRATE PROCESSING AND METHOD FOR...
- Publication number 20220372353
- Publication date Nov 24, 2022
- Shin-Etsu Chemical Co., Ltd.
- Masahito TANABE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CLEANING SOLUTION FOR TEMPORARY ADHESIVE FOR SUBSTRATES, SUBSTRATE...
- Publication number 20220195352
- Publication date Jun 23, 2022
- Shin-Etsu Chemical Co., Ltd.
- Michihiro SUGO
- B08 - CLEANING
Information Patent Application
DETERGENT COMPOSITION, SUBSTRATE CLEANING METHOD, AND CLEANING METH...
- Publication number 20220186152
- Publication date Jun 16, 2022
- Shin-Etsu Chemical Co., Ltd.
- Masahito TANABE
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
METHOD FOR MANUFACTURING LAMINATE AND METHOD FOR MANUFACTURING SUBS...
- Publication number 20200144093
- Publication date May 7, 2020
- Shin-Etsu Chemical Co., Ltd.
- Masahito TANABE
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR MANUFACTURING THIN SUBSTRATE
- Publication number 20190371644
- Publication date Dec 5, 2019
- Shin-Etsu Chemical Co., Ltd.
- Masahito TANABE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
TEMPORARY ADHESIVE FILM ROLL FOR SUBSTRATE PROCESSING, METHOD FOR M...
- Publication number 20180350650
- Publication date Dec 6, 2018
- Shin-Etsu Chemical Co., Ltd.
- Masahito TANABE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WAFER PROCESSING LAMINATE, TEMPORARY ADHESIVE MATERIAL FOR WAFER PR...
- Publication number 20170110360
- Publication date Apr 20, 2017
- Shin-Etsu Chemical Co., Ltd.
- Shohei TAGAMI
- B32 - LAYERED PRODUCTS
Information Patent Application
TEMPORARY ADHESION METHOD AND METHOD FOR PRODUCING THIN WAFER
- Publication number 20170101555
- Publication date Apr 13, 2017
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki YASUDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WAFER PROCESSING LAMINATE, TEMPORARY ADHESIVE MATERIAL FOR WAFER PR...
- Publication number 20170069521
- Publication date Mar 9, 2017
- Shin-Etsu Chemical Co., Ltd.
- Michihiro SUGO
- B32 - LAYERED PRODUCTS
Information Patent Application
WAFER PROCESSING BONDING ARRANGEMENT, WAFER LAMINATE, AND THIN WAFE...
- Publication number 20170053821
- Publication date Feb 23, 2017
- Shin-Etsu Chemical Co., Ltd.
- Michihiro Sugo
- B32 - LAYERED PRODUCTS
Information Patent Application
WAFER PROCESSING TEMPORARY BONDING ARRANGEMENT, WAFER PROCESSING LA...
- Publication number 20170004989
- Publication date Jan 5, 2017
- Shin-Etsu Chemical Co., Ltd.
- Masahito Tanabe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WAFER PROCESSING LAMINATE, TEMPORARY ADHESIVE MATERIAL FOR WAFER PR...
- Publication number 20160189996
- Publication date Jun 30, 2016
- Shin-Etsu Chemical Co., Ltd.
- Masahito TANABE
- B32 - LAYERED PRODUCTS
Information Patent Application
WAFER TEMPORARY BONDING METHOD AND THIN WAFER MANUFACTURING METHOD
- Publication number 20160189998
- Publication date Jun 30, 2016
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING LAMINATE, TEMPORARY ADHESIVE MATERIAL FOR WAFER PR...
- Publication number 20160093522
- Publication date Mar 31, 2016
- Shin-Etsu Chemical Co., Ltd.
- Shohei TAGAMI
- B32 - LAYERED PRODUCTS
Information Patent Application
WAFER PROCESSING LAMINATE, WAFER PROCESSING MEMBER, TEMPORARY ADHER...
- Publication number 20140154868
- Publication date Jun 5, 2014
- Shin-Etsu Chemical Co., Ltd.
- Michihiro SUGO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
TEMPORARY ADHESIVE FOR WAFER PROCESSING, MEMBER FOR WAFER PROCESSIN...
- Publication number 20130302983
- Publication date Nov 14, 2013
- Shin-Etsu Chemical Co., Ltd.
- Masahito TANABE
- B32 - LAYERED PRODUCTS

Masahito TANABE

Person

Patents Grantslast 30 patents

Cleaning solution for temporary adhesive for substrates, substrate...

Detergent composition, substrate cleaning method, and cleaning meth...

Cleaning solution for temporary adhesive for substrates, substrate...

Method for manufacturing laminate and method for manufacturing subs...

Method for manufacturing thin substrate

Temporary adhesive film roll for substrate processing, method for m...

Wafer processing laminate, temporary adhesive material for wafer pr...

Wafer processing laminate, temporary adhesive material for wafer pr...

Wafer processing laminate, temporary adhesive material for wafer pr...

Wafer processing temporary bonding arrangement, wafer processing la...

Wafer processing bonding arrangement, wafer laminate, and thin wafe...

Temporary adhesion method and method for producing thin wafer

Wafer processing laminate, temporary adhesive material for wafer pr...

Wafer temporary bonding method and thin wafer manufacturing method

Temporary adhesive for wafer processing, member for wafer processin...

Wafer processing laminate, wafer processing member, temporary adher...

Patents Applicationslast 30 patents

TEMPORARY ADHESION METHOD, DEVICE WAFER PROCESSING METHOD, LAMINATE...

TEMPORARY ADHESIVE MATERIAL FOR SUBSTRATE PROCESSING AND METHOD FOR...

CLEANING SOLUTION FOR TEMPORARY ADHESIVE FOR SUBSTRATES, SUBSTRATE...

DETERGENT COMPOSITION, SUBSTRATE CLEANING METHOD, AND CLEANING METH...

METHOD FOR MANUFACTURING LAMINATE AND METHOD FOR MANUFACTURING SUBS...

METHOD FOR MANUFACTURING THIN SUBSTRATE

TEMPORARY ADHESIVE FILM ROLL FOR SUBSTRATE PROCESSING, METHOD FOR M...

WAFER PROCESSING LAMINATE, TEMPORARY ADHESIVE MATERIAL FOR WAFER PR...

TEMPORARY ADHESION METHOD AND METHOD FOR PRODUCING THIN WAFER

WAFER PROCESSING LAMINATE, TEMPORARY ADHESIVE MATERIAL FOR WAFER PR...

WAFER PROCESSING BONDING ARRANGEMENT, WAFER LAMINATE, AND THIN WAFE...

WAFER PROCESSING TEMPORARY BONDING ARRANGEMENT, WAFER PROCESSING LA...

WAFER PROCESSING LAMINATE, TEMPORARY ADHESIVE MATERIAL FOR WAFER PR...

WAFER TEMPORARY BONDING METHOD AND THIN WAFER MANUFACTURING METHOD

WAFER PROCESSING LAMINATE, TEMPORARY ADHESIVE MATERIAL FOR WAFER PR...

WAFER PROCESSING LAMINATE, WAFER PROCESSING MEMBER, TEMPORARY ADHER...

TEMPORARY ADHESIVE FOR WAFER PROCESSING, MEMBER FOR WAFER PROCESSIN...