Masahumi Yamato

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Adhesion method and electronic component
- Patent number 6,918,983
- Issue date Jul 19, 2005
- Polymatech Co., Ltd.
- Masayuki Tobita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat conductive mold and manufacturing method thereof
- Patent number 6,761,842
- Issue date Jul 13, 2004
- Polymatech Co., Ltd.
- Masayuki Tobita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat conductive adhesive film and manufacturing method thereof and...
- Patent number 6,663,969
- Issue date Dec 16, 2003
- Polymatech Co., Ltd.
- Tobita Masayuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesion method and electronic component
- Patent number 6,649,012
- Issue date Nov 18, 2003
- Polymatech Co., Ltd.
- Tobita Masayuki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Adhesion method and electronic component
- Publication number 20040041257
- Publication date Mar 4, 2004
- POLYMATECH CO., LTD.
- MasayukiTobita Tobita
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Heat conductive mold and manufacturing method thereof
- Publication number 20030153665
- Publication date Aug 14, 2003
- POLYMATECH CO., LTD.
- Masayuki Tobita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat conductive adhesive film and manufacturing method thereof and...
- Publication number 20020050585
- Publication date May 2, 2002
- Tobita Masayuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesion method and electronic component
- Publication number 20010004131
- Publication date Jun 21, 2001
- Tobita Masayuki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Heat conductive mold and manufacturing method thereof
- Publication number 20010004546
- Publication date Jun 21, 2001
- Masayuki Tobita
- H01 - BASIC ELECTRIC ELEMENTS