Masakatsu Tanji

Person

  • Oi, JP

Patents Grantslast 30 patents

  • Information Patent Grant

    Circuit board packaging structure

    • Patent number 8,665,608
    • Issue date Mar 4, 2014
    • Hitachi, Ltd.
    • Yoshito Hayashi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    CIRCUIT BOARD PACKAGING STRUCTURE

    • Publication number 20110292620
    • Publication date Dec 1, 2011
    • Hitachi, Ltd.
    • YOSHITO HAYASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR