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Masakatsu Tanji
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Oi, JP
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last 30 patents
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Patent Grant
Circuit board packaging structure
Patent number
8,665,608
Issue date
Mar 4, 2014
Hitachi, Ltd.
Yoshito Hayashi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
CIRCUIT BOARD PACKAGING STRUCTURE
Publication number
20110292620
Publication date
Dec 1, 2011
Hitachi, Ltd.
YOSHITO HAYASHI
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR