Masakazu Aoyama

Person

Ogaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring board
- Patent number 9,425,137
- Issue date Aug 23, 2016
- Ibiden Co., Ltd.
- Nobuyuki Naganuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flex-rigid wiring board and method of manufacturing the same
- Patent number 9,271,405
- Issue date Feb 23, 2016
- Ibiden Co., Ltd.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 8,934,262
- Issue date Jan 13, 2015
- Ibiden Co., Ltd.
- Masakazu Aoyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 8,933,556
- Issue date Jan 13, 2015
- Ibiden Co., Ltd.
- Nobuyuki Naganuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flex-rigid wiring board and method of manufacturing the same
- Patent number 8,925,194
- Issue date Jan 6, 2015
- Ibiden Co., Ltd.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flex-rigid wiring board and method for manufacturing the same
- Patent number 8,759,687
- Issue date Jun 24, 2014
- Ibiden Co., Ltd.
- Nobuyuki Naganuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board and manufacturing method of multila...
- Patent number 8,737,087
- Issue date May 27, 2014
- Ibiden Co., Ltd.
- Yasuhiro Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 8,687,380
- Issue date Apr 1, 2014
- Ibiden Co., Ltd.
- Masakazu Aoyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method of manufacturing wiring board
- Patent number 8,669,480
- Issue date Mar 11, 2014
- Ibiden Co., Ltd.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flex-rigid wiring board and method for manufacturing the same
- Patent number 8,658,904
- Issue date Feb 25, 2014
- Ibiden Co., Ltd.
- Nobuyuki Naganuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method of manufacturing wiring board
- Patent number 8,648,263
- Issue date Feb 11, 2014
- Ibiden Co., Ltd.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flex-rigid wiring board and method for manufacturing the same
- Patent number 8,569,630
- Issue date Oct 29, 2013
- Ibiden Co., Ltd.
- Nobuyuki Naganuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing wiring board
- Patent number 8,522,429
- Issue date Sep 3, 2013
- Ibiden Co., Ltd.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flex-rigid wiring board and method of manufacturing the same
- Patent number 8,525,038
- Issue date Sep 3, 2013
- Ibiden Co., Ltd.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flex-rigid wiring board and method for manufacturing the same
- Patent number 8,493,747
- Issue date Jul 23, 2013
- Ibiden Co., Ltd.
- Nobuyuki Naganuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a flex-rigid wiring board
- Patent number 8,479,389
- Issue date Jul 9, 2013
- Ibiden Co., Ltd.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board
- Patent number 8,481,424
- Issue date Jul 9, 2013
- Ibiden Co., Ltd.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flex-rigid wiring board and method of manufacturing the same
- Patent number 8,476,531
- Issue date Jul 2, 2013
- Ibiden Co., Ltd.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flex-rigid wiring board and method for manufacturing the same
- Patent number 8,461,459
- Issue date Jun 11, 2013
- Ibiden Co., Ltd.
- Nobuyuki Naganuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flex-rigid wiring board and method for manufacturing the same
- Patent number 8,404,978
- Issue date Mar 26, 2013
- Ibiden Co., Ltd.
- Nobuyuki Naganuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 8,400,782
- Issue date Mar 19, 2013
- Ibiden Co., Ltd.
- Masakazu Aoyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flex-rigid wiring board and method of manufacturing the same
- Patent number 8,399,775
- Issue date Mar 19, 2013
- Ibiden Co., Ltd.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flex-rigid wiring board and method for manufacturing the same
- Patent number 8,383,948
- Issue date Feb 26, 2013
- Ibiden Co., Ltd.
- Masakazu Aoyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing wiring board
- Patent number 8,359,738
- Issue date Jan 29, 2013
- Ibiden Co., Ltd.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of multilayer printed wiring board
- Patent number 8,353,103
- Issue date Jan 15, 2013
- Ibiden Co., Ltd.
- Yasuhiro Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board
- Patent number 8,212,363
- Issue date Jul 3, 2012
- Ibiden Co., Ltd.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flex-rigid wiring board and method of manufacturing the same
- Patent number 8,188,371
- Issue date May 29, 2012
- Ibiden Co., Ltd.
- Michimasa Takahashi
Information Patent Grant
Method of forming a multilayer printed wiring board having a bulged...
- Patent number 8,181,341
- Issue date May 22, 2012
- Ibiden Co., Ltd.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method of manufacturing wiring board
- Patent number 8,178,789
- Issue date May 15, 2012
- Ibiden Co., Ltd.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flex-rigid wiring board including flexible substrate and non-flexib...
- Patent number 8,071,883
- Issue date Dec 6, 2011
- Ibiden Co., Ltd.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150075848
- Publication date Mar 19, 2015
- IBIDEN CO., LTD.
- Nobuyuki NAGANUMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND MANUFACTURING METHOD OF MULTILA...
- Publication number 20130112469
- Publication date May 9, 2013
- IBIDEN CO., LTD.
- Yasuhiro WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEX-RIGID WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120291276
- Publication date Nov 22, 2012
- IBIDEN CO., LTD.
- Michimasa TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120008296
- Publication date Jan 12, 2012
- IBIDEN CO., LTD.
- Masakazu AOYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEX-RIGID WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120008290
- Publication date Jan 12, 2012
- IBIDEN CO., LTD.
- Michimasa TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120008297
- Publication date Jan 12, 2012
- IBIDEN CO., LTD.
- Masakazu AOYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD
- Publication number 20120005889
- Publication date Jan 12, 2012
- IBIDEN CO., LTD.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEX-RIGID WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110308079
- Publication date Dec 22, 2011
- IBIDEN CO., LTD.
- Michimasa TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD
- Publication number 20110296679
- Publication date Dec 8, 2011
- IBIDEN CO., LTD.
- Michimasa TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD
- Publication number 20110277322
- Publication date Nov 17, 2011
- IBIDEN CO., LTD.
- Michimasa TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD
- Publication number 20110252640
- Publication date Oct 20, 2011
- IBIDEN CO., LTD.
- Michimasa TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD
- Publication number 20110247212
- Publication date Oct 13, 2011
- IBIDEN CO., LTD.
- Michimasa TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEX-RIGID WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110220407
- Publication date Sep 15, 2011
- IBIDEN CO., LTD.
- Michimasa TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD
- Publication number 20110209344
- Publication date Sep 1, 2011
- IBIDEN CO., LTD.
- Michimasa TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110203837
- Publication date Aug 25, 2011
- IBIDEN CO., LTD.
- Nobuyuki Naganuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110198111
- Publication date Aug 18, 2011
- IBIDEN CO., LTD.
- Nobuyuki Naganuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110199739
- Publication date Aug 18, 2011
- IBIDEN CO., LTD.
- Nobuyuki Naganuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110194262
- Publication date Aug 11, 2011
- IBIDEN, CO., LTD.
- Nobuyuki Naganuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110180908
- Publication date Jul 28, 2011
- IBIDEN CO., LTD.
- Nobuyuki Naganuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110180306
- Publication date Jul 28, 2011
- IBIDEN CO., LTD.
- Nobuyuki Naganuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110180307
- Publication date Jul 28, 2011
- IBIDEN CO., LTD.
- Nobuyuki Naganuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110067904
- Publication date Mar 24, 2011
- IBIDEN CO., LTD.
- Masakazu Aoyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110019383
- Publication date Jan 27, 2011
- IBIDEN CO., LTD.
- Masakazu Aoyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD
- Publication number 20100252318
- Publication date Oct 7, 2010
- IBIDEN CO., LTD.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer Printed Wiring Board
- Publication number 20100155130
- Publication date Jun 24, 2010
- IBIDEN CO., LTD.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEX-RIGID WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100018634
- Publication date Jan 28, 2010
- IBIDEN CO., LTD.
- Michimasa TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND MANUFACTURING METHOD OF THE MUL...
- Publication number 20100000087
- Publication date Jan 7, 2010
- IBIDEN CO., LTD.
- Yasuhiro WATANABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD
- Publication number 20090255111
- Publication date Oct 15, 2009
- IBIDEN CO., LTD.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEX-RIGID WIRING BOARD AND METHOD OF MANUFACTURING SAME
- Publication number 20090242241
- Publication date Oct 1, 2009
- IBIDEN CO., LTD.
- Michimasa TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD
- Publication number 20090038836
- Publication date Feb 12, 2009
- IBIDEN, CO., LTD.
- Michimasa TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Masakazu Aoyama

Person

Patents Grantslast 30 patents

Wiring board

Flex-rigid wiring board and method of manufacturing the same

Wiring board and method for manufacturing the same

Wiring board

Flex-rigid wiring board and method of manufacturing the same

Flex-rigid wiring board and method for manufacturing the same

Multilayer printed wiring board and manufacturing method of multila...

Wiring board and method for manufacturing the same

Wiring board and method of manufacturing wiring board

Flex-rigid wiring board and method for manufacturing the same

Wiring board and method of manufacturing wiring board

Flex-rigid wiring board and method for manufacturing the same

Method of manufacturing wiring board

Flex-rigid wiring board and method of manufacturing the same

Flex-rigid wiring board and method for manufacturing the same

Method of manufacturing a flex-rigid wiring board

Multilayer printed wiring board

Flex-rigid wiring board and method of manufacturing the same

Flex-rigid wiring board and method for manufacturing the same

Flex-rigid wiring board and method for manufacturing the same

Wiring board and method for manufacturing the same

Flex-rigid wiring board and method of manufacturing the same

Flex-rigid wiring board and method for manufacturing the same

Method of manufacturing wiring board

Manufacturing method of multilayer printed wiring board

Multilayer printed wiring board

Flex-rigid wiring board and method of manufacturing the same

Method of forming a multilayer printed wiring board having a bulged...

Wiring board and method of manufacturing wiring board

Flex-rigid wiring board including flexible substrate and non-flexib...

Patents Applicationslast 30 patents

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

MULTILAYER PRINTED WIRING BOARD AND MANUFACTURING METHOD OF MULTILA...

FLEX-RIGID WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

FLEX-RIGID WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

MULTILAYER PRINTED WIRING BOARD

FLEX-RIGID WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD

WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD

WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD

WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD

FLEX-RIGID WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD

FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

MULTILAYER PRINTED WIRING BOARD

Multilayer Printed Wiring Board

FLEX-RIGID WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

MULTILAYER PRINTED WIRING BOARD AND MANUFACTURING METHOD OF THE MUL...

MULTILAYER PRINTED WIRING BOARD

FLEX-RIGID WIRING BOARD AND METHOD OF MANUFACTURING SAME

WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD