Masakazu Baba

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Kagoshima, JP

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Patents Grantslast 30 patents

Information Patent Grant
Solid-state image pickup apparatus, method of manufacturing solid-s...
- Patent number 11,177,300
- Issue date Nov 16, 2021
- Sony Corporation
- Hirokazu Seki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with groove structure to prevent molding resin...
- Patent number 8,525,285
- Issue date Sep 3, 2013
- Sony Corporation
- Shuji Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with groove structure to prevent molding resin...
- Patent number 8,153,467
- Issue date Apr 10, 2012
- Sony Corporation
- Shuji Yoneda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOLID-STATE IMAGE PICKUP APPARATUS, METHOD OF MANUFACTURING SOLID-S...
- Publication number 20180083056
- Publication date Mar 22, 2018
- SONY CORPORATION
- HIROKAZU SEKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120161271
- Publication date Jun 28, 2012
- SONY CORPORATION
- Shuji Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20090243015
- Publication date Oct 1, 2009
- SONY CORPORATION
- Shuji Yoneda
- H01 - BASIC ELECTRIC ELEMENTS