Masakazu Nakada

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Aichi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Multilayer wiring board and fabricating method of the same
- Patent number 7,642,468
- Issue date Jan 5, 2010
- Sony Corporation
- Masakazu Nakada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connection materials and electrical connection method
- Patent number 7,244,675
- Issue date Jul 17, 2007
- Sony Corporation
- Noriyuki Honda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connection materials and electrical connection methods
- Patent number 7,078,807
- Issue date Jul 18, 2006
- Sony Corporation
- Noriyuki Honda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER WIRING BOARD AND FABRICATING METHOD OF THE SAME
- Publication number 20060274510
- Publication date Dec 7, 2006
- Masakazu Nakada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical connection materials and electrical connection methods
- Publication number 20050194680
- Publication date Sep 8, 2005
- Noriyuki Honda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Sealing resin for flip-flop mounting
- Publication number 20030011077
- Publication date Jan 16, 2003
- Masayuki Morishima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical connection materials and electrical connection method
- Publication number 20020173145
- Publication date Nov 21, 2002
- Noriyuki Honda
- H01 - BASIC ELECTRIC ELEMENTS