Masakazu TAKAZAWA

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Nonoichi-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Dividing device for wafer
- Patent number 12,036,700
- Issue date Jul 16, 2024
- NAKAMURA-TOME PRECISION INDUSTRY CO., LTD.
- Tsuyoshi Naya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DIVIDING DEVICE FOR WAFER
- Publication number 20210129380
- Publication date May 6, 2021
- NAKAMURA-TOME PRECISION INDUSTRY CO., LTD.
- Tsuyoshi NAYA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR