Masakazu YATOU

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Kariya-city, JP

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Patents Grantslast 30 patents

Information Patent Grant
Substrate bonding method
- Patent number 10,622,246
- Issue date Apr 14, 2020
- Denso Corporation
- Masakazu Yatou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Physical quantity sensing semiconductor device and method for manuf...
- Patent number 10,209,155
- Issue date Feb 19, 2019
- Denso Corporation
- Kouhei Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180172530
- Publication date Jun 21, 2018
- Denso Corporation
- Kouhei YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING METHOD
- Publication number 20180033680
- Publication date Feb 1, 2018
- Denso Corporation
- Masakazu YATOU
- B32 - LAYERED PRODUCTS