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Masakazu Yoshimoto
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Akashi-shi, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Pretreatment solution for providing catalyst for electroless platin...
Patent number
7,166,152
Issue date
Jan 23, 2007
Daiwa Fine Chemicals Co., Ltd.
Yoshiaki Okuhama
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Method for forming circuit pattern
Patent number
7,056,448
Issue date
Jun 6, 2006
Daiwa Fine Chemicals Co., Ltd.
Yoshiaki Okuhama
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Aqueous solutions for obtaining metals by reductive deposition
Patent number
6,183,545
Issue date
Feb 6, 2001
Daiwa Fine Chemicals Co., Ltd.
Yoshiaki Okuhama
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Electroplating solution for forming Pb-Sn alloy bump electrodes on...
Patent number
5,651,873
Issue date
Jul 29, 1997
Mitsubishi Materials Corporation
Naoki Uchiyama
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Electrolytic process for producing lead sulfonate and tin sulfonate...
Patent number
5,618,404
Issue date
Apr 8, 1997
Daiwa Fine Chemicals Co., Ltd.
Yoshiaki Okuhama
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Tin, lead, or tin-lead alloy plating bath
Patent number
4,673,470
Issue date
Jun 16, 1987
Obata; Keigo
Keigo Obata
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Tin, lead, and tin-lead alloy plating baths
Patent number
4,459,185
Issue date
Jul 10, 1984
Obata, Doni, Daiwa, Fine Chemicals Co., Ltd.
Keigo Obata
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Patents Applications
last 30 patents
Information
Patent Application
SILVER ELECTROPLATING SOLUTION
Publication number
20150184307
Publication date
Jul 2, 2015
DAIWA FINE CHEMICALS CO., LTD. (LABORATORY)
Yohei Hosokawa
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
METHOD FOR SILVER PLATING
Publication number
20090159453
Publication date
Jun 25, 2009
DAIWA FINE CHEMICALS CO., LTD.
Masakazu Yoshimoto
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Method For Silver Plating
Publication number
20070284258
Publication date
Dec 13, 2007
Masakazu Yoshimoto
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Tin-containing plating bath
Publication number
20060113006
Publication date
Jun 1, 2006
Akihiro Masuda
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Method for forming circuit pattern
Publication number
20050258134
Publication date
Nov 24, 2005
DAIWA FINE CHEMICALS CO., LTD.
Yoshiaki Okuhama
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Pretreatment solution for providing catalyst for electroless platin...
Publication number
20040043153
Publication date
Mar 4, 2004
DAIWA FINE CHEMICALS CO., LTD.
Yoshiaki Okuhama
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Tin or tin alloy plating bath, tin salt solution and acid or comple...
Publication number
20030150743
Publication date
Aug 14, 2003
DAIWA FINE CHEMICALS CO., LTD.
Keigo Obata
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR