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Masaki Kanazawa

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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    WORKPIECE PROCESSING APPARATUS
    • Publication number 20240400339
    • Publication date Dec 5, 2024
    • Tokyo Seimitsu Co., Ltd.
    • Masaki KANAZAWA
    • B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
  • Information Patent Application

    TAPE AFFIXING SYSTEM
    • Publication number 20240124258
    • Publication date Apr 18, 2024
    • Tokyo Seimitsu Co., Ltd.
    • Kiyotaka KIZAKI
    • B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
  • Information Patent Application

    PROCESSING DEVICE
    • Publication number 20230302603
    • Publication date Sep 28, 2023
    • TOKYO SEIMITSU CO., LTD.
    • Fumio MASE
    • B24 - GRINDING POLISHING
  • Information Patent Application

    PROCESSING DEVICE AND METHOD
    • Publication number 20230238257
    • Publication date Jul 27, 2023
    • TOKYO SEIMITSU CO., LTD.
    • Masaki KANAZAWA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PROCESSING DEVICE AND METHOD FOR SETTING PROCESSING DEVICE
    • Publication number 20190210178
    • Publication date Jul 11, 2019
    • TOKYO SEIMITSU CO., LTD.
    • Makato SHIMODA
    • B24 - GRINDING POLISHING
  • Information Patent Application

    PROCESSING DEVICE
    • Publication number 20180345439
    • Publication date Dec 6, 2018
    • TOKYO SEIMITSU CO., LTD.
    • Makoto SHIMODA
    • B24 - GRINDING POLISHING
  • Information Patent Application

    GRINDING MACHINE
    • Publication number 20180229341
    • Publication date Aug 16, 2018
    • TOKYO SEIMITSU CO., LTD.
    • Masaki KANAZAWA
    • B24 - GRINDING POLISHING
  • Information Patent Application

    GRINDING APPARATUS
    • Publication number 20180215006
    • Publication date Aug 2, 2018
    • Tokyo Seimitsu Co, Ltd.
    • Masaki KANAZAWA
    • B24 - GRINDING POLISHING
  • Information Patent Application

    WAFER PROCESSING METHOD FOR PROCESSING WAFER HAVING BUMPS FORMED TH...
    • Publication number 20090191796
    • Publication date Jul 30, 2009
    • Masaki Kanazawa
    • B24 - GRINDING POLISHING
  • Information Patent Application

    WAFER GRINDING MACHINE AND WAFER GRINDING METHOD
    • Publication number 20090163120
    • Publication date Jun 25, 2009
    • Masaki Kanazawa
    • B24 - GRINDING POLISHING
  • Information Patent Application

    Film Peeling Method and Film Peeling Device
    • Publication number 20090107634
    • Publication date Apr 30, 2009
    • Masaki Kanazawa
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Method and apparatus for peeling surface protective film
    • Publication number 20070087475
    • Publication date Apr 19, 2007
    • Masaki Kanazawa
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL